JAJSR89 August   2024 AMC0106M25

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information (DEN Package)
    5. 5.5 Package Characteristics
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Modulator
      3. 6.3.3 Isolation Channel Signal Transmission
      4. 6.3.4 Digital Output
        1. 6.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 6.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Shunt Resistor Sizing
        2. 7.2.2.2 Input Filter Design
        3. 7.2.2.3 Bitstream Filtering
        4. 7.2.2.4 Designing the Bootstrap Supply
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

5.4 Thermal Information (DEN Package)

THERMAL METRIC(1) DEN (VSON) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 64.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.7 °C/W
RθJB Junction-to-board thermal resistance 29.6 °C/W
ΨJT Junction-to-top characterization parameter 10.1 °C/W
ΨJB Junction-to-board characterization parameter 29.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 23.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.