JAJSSS6B January   2024  – June 2024 TPS7H3014-SP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (IN), VLDO and REFCAP
        1. 8.3.1.1 Undervoltage Lockout (VPOR_IN < VIN < UVLO)
        2. 8.3.1.2 Power-On Reset (VIN < VPOR_IN )
      2. 8.3.2 SENSEx Inputs
        1. 8.3.2.1 VTH_SENSEX and VONx
        2. 8.3.2.2 IHYS_SENSEx and VOFFx
        3. 8.3.2.3 Top and Bottom Resistive Divider Design Equations
      3. 8.3.3 Output Stages (ENx,SEQ_DONE,PWRGD,PULL_UP1 and PULL_UP2)
      4. 8.3.4 User-Programmable TIMERS
        1. 8.3.4.1 DLY_TMR
        2. 8.3.4.2 REG_TMR
      5. 8.3.5 UP and DOWN
      6. 8.3.6 FAULT
      7. 8.3.7 State Machine
    4. 8.4 Daisy Chain
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Self Contained – Sequence UP and DOWN
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Power Supplies and Decoupling Capacitors
          2. 9.2.1.2.2 UP and DOWN Thresholds
          3. 9.2.1.2.3 SENSEx Thresholds
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Sequencing of Negative Voltage Rails
        1. 9.2.2.1 Negative Voltage Design Equations
    3. 9.3 Externally Induced System RESET
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS7H3014-SP UNIT
HFT (CFP)
22 pins
RθJA Junction-to-ambient thermal resistance 34.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.7 °C/W
RθJB Junction-to-board thermal resistance 17.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.9 °C/W
ΨJT Junction-to-top characterization parameter 8.6 °C/W
ΨJB Junction-to-board characterization parameter 17 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.