JAJSU80 March   2024

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
    1. 3.1 機能ブロック図
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        16
          2.        17
          3.        18
          4.        19
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        22
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        25
          2.        26
          3.        27
          4.        28
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        31
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        34
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        37
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        40
          2.        41
          3.        42
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        45
        2. 5.3.8.2 MCU Domain
          1.        47
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
          3.        58
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        61
          2.        62
        2. 5.3.11.2 MCU Domain
          1.        64
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        67
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
        2. 5.3.13.2 MCU Domain
          1.        76
        3. 5.3.13.3 WKUP Domain
          1.        78
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
        2. 5.3.14.2 MCU Domain
          1.        84
          2.        85
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        88
          2.        89
          3.        90
          4.        91
          5.        92
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        95
          2.        96
          3.        97
        2. 5.3.16.2 MCU Domain
          1.        99
          2.        100
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        103
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        106
          2.        107
          3.        108
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        111
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        114
      22. 5.3.21 Power Supply
        1.       116
      23. 5.3.22 Reserved
        1.       118
      24. 5.3.23 SERDES
        1. 5.3.23.1 MAIN Domain
          1.        121
          2.        122
          3.        123
      25. 5.3.24 System and Miscellaneous
        1. 5.3.24.1 Boot Mode Configuration
          1. 5.3.24.1.1 MAIN Domain
            1.         127
        2. 5.3.24.2 Clock
          1. 5.3.24.2.1 MCU Domain
            1.         130
          2. 5.3.24.2.2 WKUP Domain
            1.         132
        3. 5.3.24.3 System
          1. 5.3.24.3.1 MAIN Domain
            1.         135
          2. 5.3.24.3.2 MCU Domain
            1.         137
          3. 5.3.24.3.3 WKUP Domain
            1.         139
        4. 5.3.24.4 VMON
          1.        141
      26. 5.3.25 TIMER
        1. 5.3.25.1 MAIN Domain
          1.        144
        2. 5.3.25.2 MCU Domain
          1.        146
        3. 5.3.25.3 WKUP Domain
          1.        148
      27. 5.3.26 UART
        1. 5.3.26.1 MAIN Domain
          1.        151
          2.        152
          3.        153
          4.        154
          5.        155
          6.        156
          7.        157
        2. 5.3.26.2 MCU Domain
          1.        159
        3. 5.3.26.3 WKUP Domain
          1.        161
      28. 5.3.27 USB
        1. 5.3.27.1 MAIN Domain
          1.        164
          2.        165
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings for AEC - Q100 Qualified Devices in the AMW Package
    3. 6.3 Power-On Hours (POH)
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Operating Performance Points
    6. 6.6 Electrical Characteristics
      1. 6.6.1 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2 Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.6.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.6.4 Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.6.5 SDIO Electrical Characteristics
      6. 6.6.6 LVCMOS Electrical Characteristics
      7. 6.6.7 CSI-2 (D-PHY) Electrical Characteristics
      8. 6.6.8 USB2PHY Electrical Characteristics
      9. 6.6.9 DDR Electrical Characteristics
    7. 6.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8 Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for AMW Package TBD
    9. 6.9 Timing and Switching Characteristics
      1. 6.9.1 Timing Parameters and Information
      2. 6.9.2 Power Supply Requirements
        1. 6.9.2.1 Power Supply Slew Rate Requirement
        2. 6.9.2.2 Power Supply Sequencing
          1. 6.9.2.2.1 Power-Up Sequencing
          2. 6.9.2.2.2 Power-Down Sequencing
          3. 6.9.2.2.3 Partial IO Power Sequencing
      3. 6.9.3 System Timing
        1. 6.9.3.1 Reset Timing
        2. 6.9.3.2 Error Signal Timing
        3. 6.9.3.3 Clock Timing
      4. 6.9.4 Clock Specifications
        1. 6.9.4.1 Input Clocks / Oscillators
          1. 6.9.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.9.4.1.1.1 Load Capacitance
            2. 6.9.4.1.1.2 Shunt Capacitance
          2. 6.9.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.9.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.9.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.9.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.9.4.2 Output Clocks
        3. 6.9.4.3 PLLs
        4. 6.9.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.9.5 Peripherals
        1. 6.9.5.1  ATL
          1. 6.9.5.1.1 ATL_PCLK Timing Requirements
          2. 6.9.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.9.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.9.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.9.5.2  CPSW3G
          1. 6.9.5.2.1 CPSW3G MDIO Timing
          2. 6.9.5.2.2 CPSW3G RMII Timing
          3. 6.9.5.2.3 CPSW3G RGMII Timing
        3. 6.9.5.3  CPTS
        4. 6.9.5.4  CSI-2
        5. 6.9.5.5  CSI-2 TX
        6. 6.9.5.6  DDRSS
        7. 6.9.5.7  DSS
        8. 6.9.5.8  ECAP
        9. 6.9.5.9  Emulation and Debug
          1. 6.9.5.9.1 Trace
          2. 6.9.5.9.2 JTAG
        10. 6.9.5.10 EPWM
        11. 6.9.5.11 EQEP
        12. 6.9.5.12 GPIO
        13. 6.9.5.13 GPMC
          1. 6.9.5.13.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.9.5.13.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.9.5.13.3 GPMC and NAND Flash — Asynchronous Mode
        14. 6.9.5.14 I2C
        15. 6.9.5.15 MCAN
        16. 6.9.5.16 MCASP
        17. 6.9.5.17 MCSPI
          1. 6.9.5.17.1 MCSPI — Controller Mode
          2. 6.9.5.17.2 MCSPI — Peripheral Mode
        18. 6.9.5.18 MMCSD
          1. 6.9.5.18.1 MMC0 - eMMC Interface
            1. 6.9.5.18.1.1  Legacy SDR Mode
            2. 6.9.5.18.1.2  High Speed SDR Mode
            3. 6.9.5.18.1.3  High Speed DDR Mode
            4. 6.9.5.18.1.4  HS200 Mode
            5. 6.9.5.18.1.5  HS400 Mode
            6. 6.9.5.18.1.6  UHS–I SDR12 Mode
            7. 6.9.5.18.1.7  UHS–I SDR25 Mode
            8. 6.9.5.18.1.8  UHS–I SDR50 Mode
            9. 6.9.5.18.1.9  UHS–I DDR50 Mode
            10. 6.9.5.18.1.10 UHS–I SDR104 Mode
          2. 6.9.5.18.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.9.5.18.2.1 Default Speed Mode
            2. 6.9.5.18.2.2 High Speed Mode
            3. 6.9.5.18.2.3 UHS–I SDR12 Mode
            4. 6.9.5.18.2.4 UHS–I SDR25 Mode
            5. 6.9.5.18.2.5 UHS–I SDR50 Mode
            6. 6.9.5.18.2.6 UHS–I DDR50 Mode
            7. 6.9.5.18.2.7 UHS–I SDR104 Mode
        19. 6.9.5.19 OSPI
          1. 6.9.5.19.1 OSPI0 PHY Mode
            1. 6.9.5.19.1.1 OSPI0 With PHY Data Training
            2. 6.9.5.19.1.2 OSPI0 Without Data Training
              1. 6.9.5.19.1.2.1 OSPI0 PHY SDR Timing
              2. 6.9.5.19.1.2.2 OSPI0 PHY DDR Timing
          2. 6.9.5.19.2 OSPI0 Tap Mode
            1. 6.9.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.9.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.9.5.20 PCIe
        21. 6.9.5.21 Timers
        22. 6.9.5.22 UART
        23. 6.9.5.23 USB
  8. 7 Detailed Description
    1. 7.1 Overview
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

6.4 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
SUPPLY NAME DESCRIPTION MIN(1) NOM MAX(1) UNIT
VDD_CORE(2)
VDDA_CORE_CSI_DSI(2)
VDDA_CORE_CSI_DSI_CLK(2)
VDDA_CORE_USB0(2)
VDDA_CORE_USB1(2)
VDDA_DDR_PLL0(2)		 Core supply
CSIRX0 and DSITX0 core supply
DSITX0 clock core supply
USB0 and USB1 core supply
DDR deskew PLL supply		 0.75-V operation 0.715 0.75 0.79 V
0.85-V operation 0.81 0.85 0.895 V
VDD_CANUART(3) CANUART core supply 0.75-V operation 0.715 0.75 0.79 V
0.85-V operation 0.81 0.85 0.895 V
VDDR_CORE RAM core supply 0.81 0.85 0.895 V
VDD_MMC0(4)
VDDA_0P85_DLL_MMC0(4)		 MMC0 PHY core supply
MMC0 DLL analog supply		 0.81 0.85 0.895 V
VDDA_0P85_SERDES
VDDA_0P85_SERDES_C		 SERDES PHY core supply
SERDES analog supply		 0.81 0.85 0.895 V
VDDS_DDR(5)
VDDS_DDR_C(5)		 DDR PHY IO supply
DDR clock IO supply		 1.1-V operation 1.06 1.1 1.17 V
VDDA_1P8_SERDES SERDES analog supply 1.71 1.8 1.89 V
VDDS_MMC0 MMC0 PHY IO supply 1.71 1.8 1.89 V
VDDS_OSC0 MCU_OSC0 and WKUP_LFOSC0 supply 1.71 1.8 1.89 V
VDDA_MCU RCOSC, POR, POK, and MCU PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL0 SMS PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL1 MAIN PLL, PER0 PLL, and PER1 PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL2 DDR PLL and ARM0 PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL3 VIDEO PLL and GPU PLL analog supply 1.71 1.8 1.89 V
VDDA_PLL4 DSS PLL0, DSS PLL1, and DSS PLL2 analog supply 1.71 1.8 1.89 V
VDDA_PLL5 C7x PLL analog supply 1.71 1.8 1.89 V
VDDA_1P8_CSI_DSI CSIRX0 and DSITX0 1.8 V analog supply 1.71 1.8 1.89 V
VDDA_1P8_OLDI0 OLDI0 1.8 V analog supply 1.71 1.8 1.89 V
VDDA_1P8_USB0
VDDA_1P8_USB1		 USB0 and USB1 1.8 V analog supply 1.71 1.8 1.89 V
VDDA_TEMP0 TEMP0 analog supply 1.71 1.8 1.89 V
VDDA_TEMP1 TEMP1 analog supply 1.71 1.8 1.89 V
VDDA_TEMP2 TEMP2 analog supply 1.71 1.8 1.89 V
VPP eFuse ROM programming supply see(6) see(6) see(6) V
VMON_1P8_SOC Voltage monitor for 1.8 V SoC power supply 1.71 1.8 1.89 V
VDDA_3P3_USB0 USB0 3.3 V analog supply 3.135 3.3 3.465 V
VDDA_3P3_USB1 USB1 3.3 V analog supply
VMON_3P3_SOC Voltage monitor for 3.3 V SoC power supply 3.135 3.3 3.465 V
VMON_ER_VSYS Voltage monitor for system power supply 0 see(7) 1 V
USB0_VBUS USB0 Level-shifted VBUS Input 0 see(8) 3.465 V
USB1_VBUS USB1 Level-shifted VBUS Input 0 see(8) 3.465 V
VDDSHV_CANUART(9) Dual-voltage IO supply for IO group CANUART 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV_MCU Dual-voltage IO supply for IO group MCU 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV0 Dual-voltage IO supply for IO group 0 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV1 Dual-voltage IO supply for IO group 1 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV2 Dual-voltage IO supply for IO group 2 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV3 Dual-voltage IO supply for IO group 3 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV5 Dual-voltage IO supply for IO group 5 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
VDDSHV6 Dual-voltage IO supply for IO group 6 1.8-V operation 1.71 1.8 1.89 V
3.3-V operation 3.135 3.3 3.465 V
TJ Operating junction temperature range Automotive Q100 –40 125 °C
Extended Industrial –40 105 °C
(1) The voltage at the device ball must never drop below the MIN voltage or rise above the MAX voltage for any amount of time during normal device operation.
(2) VDD_CORE, VDDA_CORE_CSI_DSI, VDDA_CORE_DSI_CLK, VDDA_CORE_USB, and VDDA_DDR_PLL0 shall be sourced from the same power source. Care should be taken to ensure that voltage differential between VDD_CORE and VDDA_CORE_USB is within +/- 1%.
(3) VDD_CANUART shall be connected to an always on power source when using Partial IO or IO Only + DDR Self-refresh low power modes. VDD_CANUART shall be connected to the same power source as VDD_CORE, VDDA_CORE_CSI_DSI, VDDA_CORE_USB, and VDDA_DDR_PLL0 when not using Partial IO or IO Only + DDR Self-refresh low power modes.
(4) VDD_MMC0 and VDDA_0P85_DLL_MMC0 must be connected to the same power source as VDD_CORE when MMC0 is not used. In this case, VDD_MMC0 and VDDA_0P85_DLL_MMC0 may be operated at a nominal voltage of 0.75 or 0.85.
(5) VDDS_DDR and VDDS_DDR_C shall be sourced from the same power source.
(6) Refer to the Recommended Operating Conditions for OTP eFuse Programming table for VPP supply voltages based on eFuse usage.
(7) The VMON_VSYS pin provides a way to monitor the system power supply. For more information, see System Power Supply Monitor Design Guidelines.
(8) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see USB VBUS Design Guidelines.
(9) VDDSHV_CANUART shall be connected to an always on power source when using Partial IO or IO Only + DDR Self-refresh low power modes. VDDSHV_CANUART shall be connected to any valid IO power source when not using Partial IO or IO Only + DDR Self-refresh low power modes.