over operating free-air temperature range (unless otherwise noted)(1)
|
VALUE |
| Supply voltage (VCC) |
±6.75VDC |
| Common-mode input voltage (VCM) |
V– to V+ |
| Power dissipation (PD) (2) |
1W |
| Junction temperature (TJ) |
175°C |
| Lead temperature (soldering, 10 seconds) |
300°C |
| Storage temperature |
–65°C ≤ TA ≤ +150°C |
| Thermal resistance |
|
| θJA |
|
| CDIP (still air) |
170°C/W |
| CDIP (500LF/min air flow) |
100°C/W |
| CLGA (still air) |
220°C/W |
| CLGA (500LF/min air flow) |
150°C/W |
| θJC |
|
| CDIP |
35°C/W |
| CLGA |
37°C/W |
| Package weight (typical) |
|
| CDIP |
1078mg |
| CLGA |
227mg |
| ESD tolerance (3) |
1000V |
(1) Operation outside the Absolute Maximum Ratings may
cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those
listed under Recommended Operating Conditions. If used outside the
Recommended Operating Conditions but within the Absolute Maximum
Ratings, the device may not be fully functional, and this may affect
device reliability, functionality, performance, and shorten the device lifetime.
(2) The maximum power dissipation must be derated at elevated
temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and
TA (ambient temperature). The maximum allowable power dissipation
at any temperature is PDmax = (TJmax – TA) /
θJA or the number given in the Absolute Maximum Ratings,
whichever is lower.
(3) Human body model, 1.5kΩ in series with 100pF.