JAJSUR3J May   1999  – June 2024 SN74LV4051A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information: SN74LV4051A
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Characteristics VCC = 2.5V ± 0.2V
    7. 5.7  Timing Characteristics VCC = 3.3V ± 0.3V
    8. 5.8  Timing Characteristics VCC = 5V ± 0.5V
    9. 5.9  AC Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.3 Thermal Information: SN74LV4051A

THERMAL METRIC(1) SN74LV4051A SN74LV4051A SN74LV4051A UNIT
D (SOIC) PW (TSSOP) RGY (VQFN)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance  115.2 140.2 89.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.0 72.6 89.7 °C/W
RθJB Junction-to-board thermal resistance 76.6 98.7 65.4 °C/W
ΨJT Junction-to-top characterization parameter 31.3 13.4 25.0 °C/W
ΨJB Junction-to-board characterization parameter 75.7 97.3 65.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 48.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.