JAJSUS7 June 2024 TLV9304-Q1
PRODMIX
THERMAL METRIC(1) | TLV9304-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC)(2) | PW (TSSOP) | |||
14 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 105.5 | 134.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 61.4 | 55.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 61.0 | 79.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 21.6 | 9.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 60.3 | 78.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |