JAJSV55 August   2024 BQ2969

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Details
        1. 7.3.1.1 Input Sense Voltage, Vx
        2. 7.3.1.2 Output Drive, OUT
        3. 7.3.1.3 Supply Input, VDD
        4. 7.3.1.4 Regulated Supply Output, REG
      2. 7.3.2 Overvoltage Sensing for OUT
      3. 7.3.3 Regulator Output Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 NORMAL Mode
      2. 7.4.2 OVERVOLTAGE Mode
      3. 7.4.3 UNDERVOLTAGE Mode
      4. 7.4.4 CUSTOMER TEST MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 サード・パーティ製品に関する免責事項
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.2.2 Detailed Design Procedure

  1. The device allows a random cell connection to the VSS, V1, V2, V3, and V4 pins. The device does not require VSS to be connected first and does not require cells to be connected in a particular order.
  2. If fewer than 4 cells are used, then an unused cell input pin Vn must be shorted to the next lower cell input pin (Vn-1).
  3. The cell input capacitors, the supply pin capacitor, and the REG output capacitor are recommended to be placed close to the device, minimizing trace length on the PCB.