JAJSVI1 October   2024 TPS25763-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Components
    5. 6.5  Thermal Information
    6. 6.6  Buck-Boost Regulator
    7. 6.7  CC Cable Detection Parameters
    8. 6.8  CC VCONN Parameters
    9. 6.9  CC PHY Parameters
    10. 6.10 Thermal Shutdown Characteristics
    11. 6.11 Oscillator Characteristics
    12. 6.12 ADC Characteristics
    13. 6.13 TVSP Parameters
    14. 6.14 Input/Output (I/O) Characteristics
    15. 6.15 BC1.2 Characteristics
    16. 6.16 I2C Requirements and Characteristics
    17. 6.17 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power Management and Supervisory Circuitry
        1. 8.3.1.1 VIN UVLO and Enable/UVLO
        2. 8.3.1.2 Internal LDO Regulators
      2. 8.3.2  TVSP Device Configuration and ESD Protection
      3. 8.3.3  External NFET and LSGD
      4. 8.3.4  Buck-Boost Regulator
        1. 8.3.4.1  Buck-Boost Regulator Operation
        2. 8.3.4.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 8.3.4.3  VIN Supply and VIN Over-Voltage Protection
        4. 8.3.4.4  Feedback Paths and Error Amplifiers
        5. 8.3.4.5  Transconductors and Compensation
        6. 8.3.4.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 8.3.4.7  VBUS Overvoltage Protection
        8. 8.3.4.8  VBUS Undervoltage Protection
        9. 8.3.4.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 8.3.4.10 Buck-Boost Peak Current Limits
      5. 8.3.5  USB-PD Physical Layer
        1. 8.3.5.1 USB-PD Encoding and Signaling
        2. 8.3.5.2 USB-PD Bi-Phase Marked Coding
        3. 8.3.5.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 8.3.5.4 USB-PD BMC Transmitter
        5. 8.3.5.5 USB-PD BMC Receiver
        6. 8.3.5.6 Squelch Receiver
      6. 8.3.6  VCONN
      7. 8.3.7  Cable Plug and Orientation Detection
        1. 8.3.7.1 Configured as a Source
        2. 8.3.7.2 Configured as a Sink
        3. 8.3.7.3 Configured as a DRP
        4. 8.3.7.4 Overvoltage Protection (Px_CC1, Px_CC2)
      8. 8.3.8  ADC
        1. 8.3.8.1 ADC Divider Ratios
      9. 8.3.9  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      10. 8.3.10 DisplayPort Hot-Plug Detect (HPD)
      11. 8.3.11 USB2.0 Low-Speed Endpoint
      12. 8.3.12 Digital Interfaces
        1. 8.3.12.1 General GPIO
        2. 8.3.12.2 I2C Buffer
      13. 8.3.13 I2C Interface
        1. 8.3.13.1 I2C Interface Description
        2. 8.3.13.2 I2C Clock Stretching
        3. 8.3.13.3 I2C Address Setting
        4. 8.3.13.4 Unique Address Interface
        5. 8.3.13.5 I2C Pullup Resistor Calculation
      14. 8.3.14 Digital Core
        1. 8.3.14.1 Device Memory
        2. 8.3.14.2 Core Microprocessor
      15. 8.3.15 NTC Input
      16. 8.3.16 Thermal Sensors and Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application GUI Selections
        2. 9.2.2.2 EEPROM Selection
        3. 9.2.2.3 EN/UVLO
        4. 9.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 9.2.2.5 Inductor Currents
        6. 9.2.2.6 Output Capacitor
        7. 9.2.2.7 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     106

I2C Requirements and Characteristics

Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over the –40°C to 150°C junction temperature range unless otherwise stated.VIN = 13.5 V, EN =2 V, unless otherwise stated. VDD = I2C pullup voltage (3.3 V or 1.8 V)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I2C_IRQ1s, I2C_IRQ2
I2C_IRQ1m
SDA and SCL Characteristics (Standard, Fast, Fast-mode Plus)
VIL Input low signal 0.54 V
VIH Input high signal 1.3 V
VDD = 3.3 V INPUT LOGIC THRESHOLDS
VIL Input low signal 0.9 V
VIH Input high signal 2.31 V
VHYS Input hysteresis 0.165 V
VOL Output low voltage VDD = 1.8V, IOL=2 mA 0.36
VOL Output low voltage VDD = 3.3V, IOL=3 mA 0.4 V
IOL Max output low current VOL=0.4 V 12 mA
ILEAK Input leakage current Voltage on pin = 3.3V –5 5 µA
CI pin capacitance (internal) 10 pF
Cb Capacitive load for each bus line (external). Applies in Standard-mode and Fast-mode. 400 pF
Cb Capacitive load for each bus line (external).  Applies in Fast-mode Plus. 550 pF
COMMON TIMING
tSP I2C pulse width suppressed 50 ns
SDA and SCL Characteristics (Standard Mode)
fSCLS Clock frequency (target) VDD = 1.8V or 3.3V 100 kHz
tHD;STA Start or repeated start condition hold time VDD = 1.8V or 3.3V 4 µs
tLOW SCL Clock low time VDD = 1.8V or 3.3V 4.7 µs
tHIGH SCL Clock high time VDD = 1.8V or 3.3V 4 µs
tSU;STA Start or repeated start condition setup time VDD = 1.8V or 3.3V 4.7 µs
tHD;DAT Serial data hold time (1) VDD = 1.8V or 3.3V 0 (2) - (3) ns
tSU;DAT Serial data setup time VDD = 1.8V or 3.3V 250 ns
tr Rise time of SCL and SDA signals VDD = 1.8V or 3.3V; RPU = 2.8 kΩ; Cb = 400pF; measure 0.3 × VDD to 0.7 × VDD 1000 ns
tof Output fall time from VIH(MIN) to VIL(MAX) VDD = 1.8V or 3.3V; measure 0.3 × VDD to 0.7 × VDD 250 (4) ns
tf Fall time of SCL and SDA signals (2) (4) (5) VDD = 1.8V, RPU = 2.8 kΩ; 10 pF ≤ Cb ≤ 400 pF 300 ns
tf Fall time of SCL and SDA signals (2) (4) (5) VDD = 3.3V, RPU = 2.8 kΩ; 10 pF ≤ Cb ≤ 400 pF 300 ns
tSU;STO Stop condition setup time VDD = 1.8V or 3.3V 4 µs
tBUF Bus free time between stop and start VDD = 1.8V or 3.3V 4.7 µs
tVD;DAT Valid data time (6) Transmitting Data; VDD = 1.8V or 3.3V, SCL low to SDA output valid 3.45 (3) µs
tVD;ACK Valid data time of ACK condition Transmitting Data; VDD = 1.8V or 3.3V, ACK signal from SCL low to SDA valid 3.45 (3) µs
SDA and SCL Characteristics (Fast Mode)
fSCLS Clock frequency (target) VDD = 1.8V or 3.3V 400 kHz
tHD;STA Start or repeated start condition hold time VDD = 1.8V or 3.3V 0.6 µs
tLOW SCL Clock low time VDD = 1.8V or 3.3V 1.3 µs
tHIGH SCL Clock high time VDD = 1.8V or 3.3V 0.6 µs
tSU;STA Start or repeated start condition setup time VDD = 1.8V or 3.3V 0.6 µs
tHD;DAT Serial data hold time (1) VDD = 1.8V or 3.3V 0 (2) - (3) ns
tSU;DAT Serial data setup time VDD = 1.8V or 3.3V 100 (7) ns
tr Rise time of SCL and SDA signals VDD = 1.8V or 3.3V; RPU = 850 Ω; Cb = 400 pF; measure 0.3 × VDD to 0.7 × VDD 20 300 ns
tof Output fall time from VIH(MIN) to VIL(MAX) VDD = 1.8V; measure 0.3 × VDD to 0.7 × VDD 6.55 250 (4) ns
tof Output fall time from VIH(MIN) to VIL(MAX) VDD = 3.3V; measure 0.3 × VDD to 0.7 × VDD 12 250 (4) ns
tf Fall time of SCL and SDA signals (2) (4) (5) VDD = 1.8V; RPU = 850 Ω; 10 pF ≤ Cb ≤ 400 pF 6.55 300 ns
tf Fall time of SCL and SDA signals (2) (4) (5) VDD = 3.3V; RPU = 850 Ω; 10 pF ≤ Cb ≤ 400 pF 12 300 ns
tSU;STO Stop condition setup time VDD = 1.8V or 3.3V 0.6 µs
tBUF Bus free time between stop and start VDD = 1.8V or 3.3V 1.3 µs
tVD;DAT Valid data time (6) Transmitting Data; VDD = 1.8V or 3.3V, SCL low to SDA output valid 0.9 (3) µs
tVD;ACK Valid data time of ACK condition Transmitting Data; VDD = 1.8V or 3.3V, ACK signal from SCL low to SDA (out) low 0.9 (3) µs
tHD;DAT = the data hold time that is measured from the falling edge of SCL, applies to data in transmission and the acknowledge.
A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(MIN) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
The maximum tHD;DAT can be 3.45 µs and 0.9 µs for Standard-mode and Fast-mode, but must be less than the maximum tVD;DAT or tVD;ACK by a transition time. This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the data must be valid by the setup time before it releases the clock.
The maximum tf for the SDA and SCL bus lines is stated in these tables as 300 ns and is longer than the specified maximum tof for the output stages (250 ns). The maximum tf allows series protection resistors (RS) to be connected between the SDA and SCL pins and the SDA and SCL bus lines without exceeding the maximum specified tf.
In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors (RS) are used, the design must allow for inclusion when considering bus timing.
tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH or LOW, depending on which one is worse).
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This requirement is automatically met if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.