JAJSVI4 October 2024 ADS127L21B
PRODUCTION DATA
Figure 9-14 is a layout example based on the circuit diagram of Figure 9-8. A four-layer PCB is used, with the inner layers dedicated as ground and power planes. Cutouts are used on the plane layers under the amplifier input pins to reduce stray capacitance to increase amplifier phase margin. Thermal vias for the ADS127L21B and THS4551 WQFN package thermal pad are not used to enable bypass capacitor placement on the bottom layer underneath the devices. Place the smaller of the parallel supply bypass capacitors closest to the device supply pins.
See the QFN and SON PCB Attachment application note for details of attaching the WQFN package to the printed circuit board.