JAJSVJ3 October   2024 ESD701

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings -JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
  8. 7 Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 ドキュメントの更新通知を受け取る方法
    3. 7.3 サポート・リソース
    4. 7.4 Trademarks
    5. 7.5 静電気放電に関する注意事項
    6. 7.6 用語集
  9. 8 ドキュメントの更新通知を受け取る方法
  10. 9 サポート・リソース
  11. 10Trademarks
  12. 11静電気放電に関する注意事項
  13. 12用語集
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

5.5 Thermal Information

THERMAL METRIC (1) ESD701 UNIT
DPY (X1SON)
2 PINS
RθJA Junction-to-ambient thermal resistance 262.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 132.3 °C/W
RθJB Junction-to-board thermal resistance 78.5 °C/W
ΨJT Junction-to-top characterization parameter 2.2 °C/W
ΨJB Junction-to-board characterization parameter 78.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.