JAJSVN4A September   2011  – November 2024 ISO7231C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Characteristics
    5. 4.5  Power Ratings
    6. 4.6  Insulation Specifications
    7. 4.7  Safety-Related Certifications
    8. 4.8  Safety Limiting Values
    9. 4.9  Electrical Characteristics: VCC1 and VCC2 at 3.3 V Operation
    10. 4.10 Electrical Characteristics: VCC1 and VCC2 at 5-V Operation
    11. 4.11 Electrical Characteristics: VCC1 at 3.3-V, VCC2 at 5-V Operation
    12. 4.12 Electrical Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    13. 4.13 Switching Characteristics: VCC1 and VCC2 at 3.3-V Operation
    14. 4.14 Switching Characteristics: VCC1 and VCC2 at 5-V Operation
    15. 4.15 Switching Characteristics: VCC1 at 3.3-V and VCC2 at 5-V Operation
    16. 4.16 Switching Characteristics: VCC1 at 5-V, VCC2 at 3.3-V Operation
    17. 4.17 Typical Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Function Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device I/O Schematics
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Insulation Characteristics Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Material
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4.8 Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IS Safety input, output, or supply current RθJA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C, see Thermal Characteristics 124 mA
RθJA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C, see Thermal Characteristics 190
TS Safety temperature 150 °C
(1) The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.