JAJU880 December   2022

 

  1.   概要
  2.   リソース
  3.   特長
  4.   アプリケーション
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Auxiliary Power Strategy
      2. 2.2.2 High-Side N-Channel MOSFET
      3. 2.2.3 Stacked AFE Communication
    3. 2.3 Highlighted Products
      1. 2.3.1 BQ76942
      2. 2.3.2 LM5168
      3. 2.3.3 ISO1640
      4. 2.3.4 TCAN1042HV
      5. 2.3.5 THVD2410
      6. 2.3.6 TPS7A25
      7. 2.3.7 MSP430FR2155
      8. 2.3.8 TMP61
      9. 2.3.9 TPD2E007
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Cell Voltage Accuracy
      2. 3.3.2 Pack Current Accuracy
      3. 3.3.3 Auxiliary Power and System Current Consumption
      4. 3.3.4 Protection
      5. 3.3.5 Working Modes Transition
      6. 3.3.6 ESD Performance
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Tools and Software
    3. 4.3 Documentation Support
    4. 4.4 サポート・リソース
    5. 4.5 Trademarks
  10. 5About the Author

2.3.9 TPD2E007

This device is a transient-voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system-level ESD protections for a wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is designed for providing system-level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (maximum) package height, is recommended for ultra space-saving applications where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.