SBAK019A July   2024  – November 2024 ADC3683-SP

 

  1.   1
  2.   2
  3.   Trademarks
  4. 1 Introduction
  5. 2 Single-Event Effects
  6. 3 Device and Test Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 Depth, Range, and LETEFF Calculation
  9. 6 Test Setup and Procedures
  10. 7 Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-Up (SEL) Results
  11. 8 Single-Event Transients (SET)
    1. 8.1 Single Event Transients
  12. 9 Event Rate Calculations
  13. 10Summary
  14. 11References
  15. 12Revision History

3 Device and Test Board Information

The ADC3683-SP is packaged in a 64-pin QFP (TI package code HBP) ceramic package as shown in Figure 3-1. An ADC3683EVMCVAL ceramic device evaluation board was used to evaluate the performance and characteristics of the ADC3683-SP under heavy-ions.

Figure 3-2 shows the top view of the evaluation board used for the radiation testing. For more detail on the EVM used for testing, see ADC36XXEVMCVAL User's Guide.

ADC3683-SP Photograph of Delidded ADC3683-SP Figure 3-1 Photograph of Delidded ADC3683-SP
ADC3683-SP ADC3683-SP Board (Top View) Figure 3-2 ADC3683-SP Board (Top View)