SBAK019A July   2024  – November 2024 ADC3683-SP

 

  1.   1
  2.   2
  3.   Trademarks
  4. 1 Introduction
  5. 2 Single-Event Effects
  6. 3 Device and Test Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 Depth, Range, and LETEFF Calculation
  9. 6 Test Setup and Procedures
  10. 7 Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-Up (SEL) Results
  11. 8 Single-Event Transients (SET)
    1. 8.1 Single Event Transients
  12. 9 Event Rate Calculations
  13. 10Summary
  14. 11References
  15. 12Revision History

1 Introduction

The ADC3683-SP is a low noise, ultra-low power 18- bit 65 MSPS high-speed dual channel ADC. Designed for lowest noise performance, the device delivers a noise spectral density of -160 dBFS/Hz combined with excellent linearity and dynamic range. The ADC3683-SP offers DC precision together with IF sampling support, making the device applicable for a wide range of applications. High-speed control loops benefit from the short latency as low as only one clock cycle. The ADC consumes only 94mW/ch at 65Msps and the power consumption scales well with lower sampling rates.

The device uses a serial LVDS (SLVDS) interface to output the data which minimizes the number of digital interconnects. The device supports two-lane, one-lane and half-lane options. The device is a pin-to-pin compatible with the 14-bit, 125MSPS ADC3664- SP. The ADC3683-SP comes in a 64-pin HBP CFP package (10.9mm × 10.9mm) and supports a temperature range from -55 to +105°C.

Table 1-1 Overview Information
Description (1)Device Information
Generic Part NumberADC3683-SP
Orderable Part Number5962F2320401VXC
Device FunctionLow-Noise Dual 18-Bit 65MSPS ADC
Device Package64-pin HBP CFP
(10.9mm × 10.9mm)
TechnologyTI C021 65nm CMOS
Exposure FacilityRadiation Effects Facility Cyclotron Institute, Texas A&M University (15MeV / Nucleon)
Heavy Ion Fluence per runUp to 1 × 107 ions/cm2
Irradiation Temperature25°C (for SET testing) and 125°C (for SEL testing)
(1) TI may provide technical applications or design advice, quality characterization, and reliability data or service. Providing these items shall not expand or otherwise affect TI's warranties as set forth in the Texas Instruments Incorporated Standard Terms and Conditions of Sale for Semiconductor Products. No obligation or liability shall arise from Semiconductor Products, and no obligation or liability shall arise from TI's provision of such items.