Assembling the TMCS-A-ADAPTER EVM with the provided components and a TMCS Hall-effect isolated current sense amplifier device is necessary before using the EVM to evaluate the performance of the TMCS device. The recommended procedure for assembling the board is as follows:

1. Solder the surface-mount components onto the board. This includes a TMCS device in the DVG, DVF, or DZP packages, a voltage supply bypass capacitor, a jumper resistor to ground, and (optional) surface mount test points.
   1. As an example, the TMCS1123 device uses the DVG package pins 8 and 3 for GND and Vs respectively. These pins correspond to the EVM traces labeled C and H respectively, so the bypass capacitor should be soldered to C and the jumper resistor should be soldered to H. An illustration of this is shown in Figure 2-1, and a picture is shown in Figure 3-1 below.
2. Solder the (optional) through-hole pin headers to the board.
3. Connect the high-current input lugs to the IN+ and IN- pads with the supplied screw, lock washer, and hex nut.
   1. The Lugs must not touch when tightened.
   2. Make sure that the lugs are positioned so that the lugs make contact with the maximum possible surface area of the PCB pad.
   3. The connectors must be tightly fastened so that the connectors cannot be moved by hand, to a torque of about 40in-lbs.

Figure 2-1 Fully Assembled EVM with TMCS1123 device