This document explains the precision benefits of using a thermally-enhanced packed, like the HVSSOP, over a typical package. Thermal dissipation is an important factor for high precision operational amplifiers (op amps), as changes in temperature cause thermal drift and error, specifically input offset voltage and bias current. Power dissipation on the device causes the internal die temperature (commonly referred to as junction temperature) to increase, which then negatively impacts the accuracy of the application. Most precision amplifiers are in leaded packages without any exposed pads for thermal dissipation. This does not typically have a significant impact on the overall performance because many precision circuits do not require significant power consumption. However, in cases with high supply voltages (for example, ±15 V) and high load currents ( >10 mA), the power dissipation of the amplifier needs to be considered.

The OPA2828 is a recent TI power op amp introduction featuring a thermal pad, that is usable with power supplies up to 36 V. The amplifier is capable of an output current of up to 30 mA from a 3 mm × 4.9 mm, 8-pin HVSSOP PowerPAD™ package. This application note describes an OPA2828 op amp circuit, developed on the DAC8811EVM, is used to explore the precision benefit of using a thermal pad over a range of power requirements, with varying ambient temperatures. This circuit design successfully showcases the impact of a PowerPAD™ thermal pad on the OPA2828's junction temperature in a high power application. On average, it was found that the HVSSOP was 48.1°C cooler than a typical package, per watt of power dissipated.