SBOA606 October   2024 OPT4001-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Assembly
  6. 3Handling
  7. 4Reliability Recommendations
  8. 5Summary
  9. 6References

1 Introduction

The TI PicoStar™ package enables ultra-small, ultra-thin device form factor. TI light sensing devices such as OPT4001YMN-Q1 offer 5x reduction in device area (1mm x 0.8mm) and 3x reduction in device thickness (0.226mm) over conventional optical packages such as the SOT-5x3 package.

Figure 1-1 Placement Side View of Packages

Additionally, the light sensor PicoStar™ package enables bottom-facing assembly for integration in space-constrained applications and minimization of stray light leakage. See Advantages of Implementing a Light Sensor in TI's Ultra-Thin PicoStar Package, application brief for more details on this package. With these advantages come some unique assembly requirements outlined in this document.