Abstract

This application note includes assembly guidelines for PicoStar™ packages available in TI's OPT3006, OPT3007, and OPT4001 devices. The PicoStar™ package's unique ultra-small, ultra-thin form factor enables light sensing in very space-constrained designs. A key advantage of the device is the bottom facing sensitive area (on the same side of the device as the pads). A cutout in the flex PCB to allow light to reach the sensor allows the device to be placed on one side of the flex PCB and look out the other, enabling the flex PCB to sit flush against the product enclosure. This further reduces the area occupied by the light sensor circuitry and creates a light seal around the sensor, reducing or eliminating the need for other light blocking materials (shrouds). This unique package and integration comes with specific assembly guidelines and considerations to make sure of the best performance, which is covered in this document.