SBOK092 December   2024 OPA4H199-SP

 

  1.   1
  2.   2
  3.   Trademarks
  4. 1 Introduction
  5. 2 Single-Event Effects (SEE)
  6. 3 Device and Test Board Information
  7. 4 Irradiation Facility and Setup
  8. 5 Depth, Range, and LETEFF Calculation
  9. 6 Test Setup and Procedures
  10. 7 Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-up (SEL) Results
  11. 8 Single-Event Transients (SET)
  12. 9 Event Rate Calculations
  13. 10Summary
  14.   A Total Ionizing Dose from SEE Experiments
  15.   B References

6 Test Setup and Procedures

SEE testing was performed on the OPA4H199-SP device mounted on an EVM. The device was provided power through the V+ and V- power supply pins of the device. 40V was provided to V+ and GND was provided to V- using the PXIe-4139. The OPA4H199-SP was evaluated for DC performance in a buffer configuration as shown below in Figure 6-1.

For SET testing, the common-mode input voltage was set to mid-supply (20V) and the output voltage was monitored for events using the PXIe-5172The trigger threshold for events was set to 5% of the expected output voltage (20V). Therefore, events are considered as output voltages greater than 21V or less than 19V.

For SEL testing, the common-mode input voltage was set equal to the power supply voltage of 40V. In this configuration, the quiescent current of the device was monitored and recorded using the PXIe-4139.

The power supply (PS) was controlled and monitored using a custom-develop LabView™ program (PXI-RadTest) running on a NI-PXIe-8135 controller. The DPO7254C was controlled using the front-panel interface. The DPO was left in the cave at all times, to minimize the probe cable length. A KVM extender was used to control and view the DPO from the control room at TAMU. For the SEL testing the device was heated using a convection heat gun aimed at the die. The junction temperature was monitored by using a thermal imaging camera attached as possible to the die.

Equipment Settings and Parameters Used During the SEE Testing of the OPA4H199-SP shows the connections, limits, and compliance values used during the testing. Figure 6-1 shows a schematic diagram of the setup used for SEE testing of the OPA4H199-SP.

Table 6-1 Equipment Settings and Parameters Used During the SEE Testing of the OPA4H199-SP
Pin Name Equipment Used Capability Range of Values Used
V+ PXIe-4139 ±60V, ±3A 40V
V- PXIe-4139 ±60V, ±3A 0V (GND)
IN+ PXIe-4139 ±60V, ±3A 20V to 40V
VOUT PXIe-5172 100MS/s —

All boards used for SEL testing were fully checked for functionality and dry runs performed to verify that the test system was stable under all bias and load conditions prior to being taken to the TAMU facility. During the heavy-ion testing, the LabView™ control program powered up the OPA4H199-SP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability had been confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters).

OPA4H199-SP Test Configuration for the OPA4H199-SP Figure 6-1 Test Configuration for the OPA4H199-SP