SBOS853B March   2017  – December 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements #GUID-D86987F5-A9B7-4506-9858-90867D8ED8B3/SBOS6814062
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Human Eye Matching
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 6.3.4 I2C Bus Overview
        1. 6.3.4.1 Serial Bus Address
        2. 6.3.4.2 Serial Interface
    4. 6.4 Device Functional Modes
      1. 6.4.1 Automatic Full-Scale Setting Mode
      2. 6.4.2 Interrupt Reporting Mechanism Modes
        1. 6.4.2.1 Latched Window-Style Comparison Mode
        2. 6.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 6.4.2.3 End-of-Conversion Mode
        4. 6.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 6.5 Programming
      1. 6.5.1 Writing and Reading
        1. 6.5.1.1 High-Speed I2C Mode
        2. 6.5.1.2 General-Call Reset Command
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Internal Registers
      1. 7.1.1 Register Descriptions
        1. 7.1.1.1 Result Register (offset = 00h)
        2. 7.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
        3. 7.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
        4. 7.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
        5. 7.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
        6. 7.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
        2. 8.2.2.2 Dark Window Selection and Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Soldering and Handling Recommendations
    2. 11.2 DNP (S-PDSO-N6) Mechanical Drawings
    3. 11.3 DTS (SOT-5X3) Mechanical Drawings

6.3.4.1 Serial Bus Address

To communicate with the OPT3001-Q1 device, the controller must first initiate an I2C start command. Then, the controller must address target devices via a target address byte. The target address byte consists of seven address bits and a direction bit that indicates whether the action is to be a read or write operation.

Four I2C addresses are possible by connecting the ADDR pin to one of four pins: GND, VDD, SDA, or SCL. Table 6-1 summarizes the possible addresses with the corresponding ADDR pin configuration. The state of the ADDR pin is sampled on every bus communication and must be driven or connected to the desired level before any activity on the interface occurs.

Table 6-1 Possible I2C Addresses with Corresponding ADDR Configuration
DEVICE I2C ADDRESSADDR PIN
1000 100GND
1000 101VDD
1000 110SDA
1000 111SCL