SBOS853B March   2017  – December 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements #GUID-D86987F5-A9B7-4506-9858-90867D8ED8B3/SBOS6814062
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Human Eye Matching
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 6.3.4 I2C Bus Overview
        1. 6.3.4.1 Serial Bus Address
        2. 6.3.4.2 Serial Interface
    4. 6.4 Device Functional Modes
      1. 6.4.1 Automatic Full-Scale Setting Mode
      2. 6.4.2 Interrupt Reporting Mechanism Modes
        1. 6.4.2.1 Latched Window-Style Comparison Mode
        2. 6.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 6.4.2.3 End-of-Conversion Mode
        4. 6.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 6.5 Programming
      1. 6.5.1 Writing and Reading
        1. 6.5.1.1 High-Speed I2C Mode
        2. 6.5.1.2 General-Call Reset Command
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Internal Registers
      1. 7.1.1 Register Descriptions
        1. 7.1.1.1 Result Register (offset = 00h)
        2. 7.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
        3. 7.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
        4. 7.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
        5. 7.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
        6. 7.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
        2. 8.2.2.2 Dark Window Selection and Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Soldering and Handling Recommendations
    2. 11.2 DNP (S-PDSO-N6) Mechanical Drawings
    3. 11.3 DTS (SOT-5X3) Mechanical Drawings

8.3 Best Design Practices

As with any optical product, special care must be taken into consideration when handling the OPT3001-Q1 device. Although the OPT3001-Q1 device has low sensitivity to dust and scratches, proper optical device handling procedures are still recommended.

The optical surface of the device must be kept clean for optimal performance in both prototyping with the device and mass production manufacturing procedures. Tweezers with plastic or rubber contact surfaces are recommended to avoid scratches on the optical surface. Avoid manipulation with metal tools when possible. The optical surface must be kept clean of fingerprints, dust, and other optical-inhibiting contaminants.

If the device optical surface requires cleaning, the use of de-ionized water or isopropyl alcohol is recommended. A few gentile brushes with a soft swab are appropriate. Avoid potentially abrasive cleaning and manipulating tools and excessive force that can scratch the optical surface.

If the OPT3001-Q1 device performs less than optimally, inspect the optical surface for dirt, scratches, or other optical artifacts.