SBOS853B March   2017  – December 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements #GUID-D86987F5-A9B7-4506-9858-90867D8ED8B3/SBOS6814062
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Human Eye Matching
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 6.3.4 I2C Bus Overview
        1. 6.3.4.1 Serial Bus Address
        2. 6.3.4.2 Serial Interface
    4. 6.4 Device Functional Modes
      1. 6.4.1 Automatic Full-Scale Setting Mode
      2. 6.4.2 Interrupt Reporting Mechanism Modes
        1. 6.4.2.1 Latched Window-Style Comparison Mode
        2. 6.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 6.4.2.3 End-of-Conversion Mode
        4. 6.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 6.5 Programming
      1. 6.5.1 Writing and Reading
        1. 6.5.1.1 High-Speed I2C Mode
        2. 6.5.1.2 General-Call Reset Command
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Internal Registers
      1. 7.1.1 Register Descriptions
        1. 7.1.1.1 Result Register (offset = 00h)
        2. 7.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
        3. 7.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
        4. 7.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
        5. 7.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
        6. 7.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
        2. 8.2.2.2 Dark Window Selection and Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Soldering and Handling Recommendations
    2. 11.2 DNP (S-PDSO-N6) Mechanical Drawings
    3. 11.3 DTS (SOT-5X3) Mechanical Drawings

8.2.2.1 Optomechanical Design

After completing the electrical design, the next task is the optomechanical design. Design a product case that includes a window to transmit the light from outside the product to the sensor, as shown in Figure 8-2. Design the window width and window height to give a ±45° field of view. A rigorous design of the field of view takes into account the location of the sensor area, as shown in Section 11. The OPT3001-Q1 active sensor area is centered along one axis of the package top view, but has a minor offset on the other axis of the top view. Window sizing and placement is discussed in more rigorous detail in the OPT3001: Ambient Light Sensor Application Guide application note.

OPT3001-Q1 Product Case and Window Over the OPT3001-Q1 DeviceFigure 8-2 Product Case and Window Over the OPT3001-Q1 Device