SBOS853B March   2017  – December 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements #GUID-D86987F5-A9B7-4506-9858-90867D8ED8B3/SBOS6814062
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Human Eye Matching
      2. 6.3.2 Automatic Full-Scale Range Setting
      3. 6.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 6.3.4 I2C Bus Overview
        1. 6.3.4.1 Serial Bus Address
        2. 6.3.4.2 Serial Interface
    4. 6.4 Device Functional Modes
      1. 6.4.1 Automatic Full-Scale Setting Mode
      2. 6.4.2 Interrupt Reporting Mechanism Modes
        1. 6.4.2.1 Latched Window-Style Comparison Mode
        2. 6.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 6.4.2.3 End-of-Conversion Mode
        4. 6.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 6.5 Programming
      1. 6.5.1 Writing and Reading
        1. 6.5.1.1 High-Speed I2C Mode
        2. 6.5.1.2 General-Call Reset Command
        3. 6.5.1.3 SMBus Alert Response
  8. 7 Register Maps
    1. 7.1 Internal Registers
      1. 7.1.1 Register Descriptions
        1. 7.1.1.1 Result Register (offset = 00h)
        2. 7.1.1.2 Configuration Register (offset = 01h) [reset = C810h]
        3. 7.1.1.3 Low-Limit Register (offset = 02h) [reset = C0000h]
        4. 7.1.1.4 High-Limit Register (offset = 03h) [reset = BFFFh]
        5. 7.1.1.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
        6. 7.1.1.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
        2. 8.2.2.2 Dark Window Selection and Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Soldering and Handling Recommendations
    2. 11.2 DNP (S-PDSO-N6) Mechanical Drawings
    3. 11.3 DTS (SOT-5X3) Mechanical Drawings

5.4 Thermal Information

THERMAL METRIC(1) OPT3001-Q1 UNIT
DNP (USON) DTS (SOT)
6 pins 8 Pins
RθJA Junction-to-ambient thermal resistance 71.2 171.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.7 83.1 °C/W
RθJB Junction-to-board thermal resistance 42.2 66.2 °C/W
ΨJT Junction-to-top characterization parameter 2.4 1.7 °C/W
ΨJB Junction-to-board characterization parameter 42.8 65.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 17.0 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.