SBOU241E April   2020  – August 2022 INA228 , INA229 , INA237 , INA238 , INA239

 

  1.   SBOU241 Abstract
  2. 1Trademarks
  3.   General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  4. 2Overview
    1. 2.1 Kit Contents
    2. 2.2 Related Documentation From Texas Instruments
  5. 3Hardware
    1. 3.1 Features
  6. 4Operation
    1. 4.1 Quick Start Setup
    2. 4.2 EVM Operation
      1. 4.2.1 Setup
        1. 4.2.1.1 Driver Installation
        2. 4.2.1.2 Firmware
          1. 4.2.1.2.1 Firmware Debug
        3. 4.2.1.3 GUI Setup and Connection
          1. 4.2.1.3.1 Initial Setup
          2. 4.2.1.3.2 GUI to EVM Connection
      2. 4.2.2 GUI Operation
        1. 4.2.2.1 Homepage Tab
        2. 4.2.2.2 Configuration Tab
        3. 4.2.2.3 Registers Tab
        4. 4.2.2.4 Results Data Tab
      3. 4.2.3 Current Sensing Operation
        1. 4.2.3.1 Detailed Setup
      4. 4.2.4 Direct EVM USB Communication
        1. 4.2.4.1 Standard USB Read and Write Operations
        2. 4.2.4.2 Collect Data Through the USB BULK Channel
      5. 4.2.5 PAMB Compatibility
  7. 5Circuitry
    1. 5.1 Current Sensing IC
    2. 5.2 Input Signal Path
    3. 5.3 Digital Circuitry
      1. 5.3.1 I2C (INA228, INA237, INA238)
      2. 5.3.2 SPI (INA229, INA239)
  8. 6Schematics, PCB Layout, and Bill of Materials
    1. 6.1 Schematics
      1. 6.1.1 SENS063 (INA228EVM, INA237EVM, INA238EVM)
      2. 6.1.2 SENS064 (INA229EVM, INA239EVM)
    2. 6.2 PCB Layout
      1. 6.2.1 SENS063 (INA228EVM, INA237EVM, INA238EVM)
      2. 6.2.2 SENS064 (INA229EVM, INA239EVM)
    3. 6.3 Bill of Materials
      1. 6.3.1 SENS063 (INA228EVM, INA237EVM, INA238EVM)
      2. 6.3.2 SENS064 (INA229EVM, INA239EVM)
  9. 7Revision History

6.2.1 SENS063 (INA228EVM, INA237EVM, INA238EVM)

Figure 6-5 through Figure 6-8 illustrate the PCB layers of the EVM.

Figure 6-5 SENS063 Top View
Figure 6-7 SENS063 Bottom View
Figure 6-6 SENS063 Top Layer
Figure 6-8 SENS063 Bottom Layer