SBOU311 October   2024 INA230

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Quick Start Setup
    2. 2.2 EVM Operation
      1. 2.2.1 Current Sensing Operation
        1. 2.2.1.1 Detailed Setup
    3. 2.3 Circuitry
      1. 2.3.1 Current Sensing IC
      2. 2.3.2 Input Signal Path
      3. 2.3.3 Digital Circuitry
    4. 2.4 PAMB Compatibility
  8. 3Software
    1. 3.1 Setup
      1. 3.1.1 Driver Installation
      2. 3.1.2 Firmware
        1. 3.1.2.1 Firmware Debug
      3. 3.1.3 GUI Setup and Connection
        1. 3.1.3.1 Initial Setup
        2. 3.1.3.2 GUI to EVM Connection
    2. 3.2 GUI Operation
      1. 3.2.1 Home Tab
      2. 3.2.2 Configuration Tab
      3. 3.2.3 Registers Tab
      4. 3.2.4 Results Data Tab
    3. 3.3 Direct EVM USB Communication
      1. 3.3.1 Standard USB Read and Write Operations
      2. 3.3.2 Collect Data Through the USB BULK Channel
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Related Documentation

4.2 PCB Layout

Board layouts are not to scale. These figures are intended to show how the board is laid out. The figures are not intended to be used for manufacturing EVM PCBs.

Figure 4-3 through Figure 4-6 illustrate the PCB layers of the INA230EVM.

INA230EVM Top ViewFigure 4-3 Top View
INA230EVM Bottom ViewFigure 4-5 Bottom View
INA230EVM Top LayerFigure 4-4 Top Layer
INA230EVM Bottom LayerFigure 4-6 Bottom Layer