SBVS162B March   2011  – July 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Enable Pin Operation
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Recommendations
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Bypass Capacitor Requirements
        4. 8.2.2.4 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage IN pin to GND pin –0.3 105 V
OUT pin to GND pin –0.3 105
OUT pin to IN pin –105 0.3
FB pin to GND pin –0.3 2
FB pin to IN pin –105 0.3
EN pin to IN pin –105 0.3
EN pin to GND pin –0.3 105
Current Peak output Internally limited
Temperature Operating virtual junction, TJ –40 125 °C
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 7 100 V
VOUT 1.161 90 V
VEN 0 100 V
IOUT 0 50 mA

6.4 Thermal Information

THERMAL METRIC(1) TPS7A4001 UNIT
DGN (HVVSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 66.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54.1 °C/W
RθJB Junction-to-board thermal resistance 38.1 °C/W
ψJT Junction-to-top characterization parameter 2 °C/W
ψJB Junction-to-board characterization parameter 37.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 15.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TJ = –40°C to 125°C, VIN = VOUT(NOM) + 2 V or VIN = 7 V (whichever is greater), VEN = VIN, IOUT = 100 µA, CIN = 1 μF, COUT = 4.7 μF, and FB tied to OUT, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 7 100 V
VREF Internal reference TJ = 25°C, VFB = VREF, VIN = 9 V, IOUT = 25 mA 1.161 1.173 1.185 V
VOUT Output voltage range(1) VIN ≥ VOUT(NOM) + 2 V VREF 90 V
Nominal accuracy TJ = 25°C, VIN = 9 V, IOUT = 25 mA –1 1 %VOUT
Overall accuracy VOUT(NOM) + 2 V ≤ VIN ≤ 24 V(2)
100 µA ≤ IOUT ≤ 50 mA		 –2.5 2.5 %VOUT
TPS7A4001 q_line_reg_bvs162.gif Line regulation 7 V ≤ VIN ≤ 100 V 0.03 %VOUT
TPS7A4001 q_load_reg_bvs162.gif Load regulation 100 µA ≤ IOUT ≤ 50 mA 0.31 %VOUT
VDO Dropout voltage VIN = 17 V, VOUT(NOM) = 18 V, IOUT = 20 mA 290 mV
VIN = 17 V, VOUT(NOM) = 18 V, IOUT = 50mA 0.78 1.3 V
ILIM Current limit VOUT = 90% VOUT(NOM), VIN = 7 V, TJ ≤ 85°C 51 117 200 mA
VOUT = 90% VOUT(NOM), VIN = 9 V 51 128 200 mA
IGND Ground current 7 V ≤ VIN ≤ 100 V, IOUT = 0 mA 25 65 μA
IOUT = 50 mA 25 μA
ISHDN Shutdown supply current VEN = 0.4 V 4.1 20 μA
IFB Feedback current(3) –0.1 0.01 0.1 µA
IEN Enable current 7 V ≤ VIN ≤ 100 V, VIN = VEN 0.02 1 μA
VEN_HI Enable high-level voltage 1.5 VIN V
VEN_LO Enable low- level voltage 0 0.4 V
VNOISE Output noise voltage VIN = 12 V, VOUT(NOM) = VREF, COUT = 10 μF,
BW = 10 Hz to 100 kHz		 58 μVRMS
VIN = 12 V, VOUT(NOM) = 5 V, COUT = 10 μF, CBYP(4) = 10 nF, BW = 10 Hz to 100 kHz 73 μVRMS
PSRR Power-supply rejection ratio VIN = 12 V, VOUT(NOM) = 5 V, COUT = 10 μF, CBYP(4) = 10 nF, ƒ = 100 Hz 65 dB
TSD Thermal shutdown temperature Shutdown, temperature increasing 170 °C
Reset, temperature decreasing 150 °C
TJ Operating junction temperature –40 125 °C
(1) To ensure stability at no-load conditions, a current from the feedback resistive network greater than or equal to 10μA is required.
(2) Maximum input voltage is limited to 24 V because of the package power dissipation limitations at full load (P ≈ (VIN – VOUT) × IOUT = (24 V – VREF) × 50 mA ≈ 1.14 W). The device is capable of sourcing a maximum current of 50 mA at higher input voltages as long as the power dissipated is within the thermal limits of the package plus any external heatsinking.
(3) IFB > 0 flows out of the device.
(4) CBYP refers to a bypass capacitor connected to the FB and OUT pins.

6.6 Typical Characteristics

At TJ = –40°C to 125°C, VIN = VOUT(NOM) + 2 V or VIN = 9 V (whichever is greater), VEN = VIN, IOUT = 100 µA, CIN = 1 μF, COUT = 4.7 μF, and FB tied to OUT, unless otherwise noted.
TPS7A4001 tc_line_trans_bvs162.gif
Figure 1. Line Transient Response vs CBYP
TPS7A4001 tc_line_reg_bvs162.png
Figure 3. Line Regulation
TPS7A4001 tc_iq-vin_bvs162.gif
Figure 5. Ground Current vs Input Voltage
TPS7A4001 tc_ignd_bvs162.png
Figure 7. Ground Current vs Output Voltage
TPS7A4001 tc_ven_threshold_bvs162.gif
Figure 9. Enable Threshold Voltage
TPS7A4001 tc_ilim_bvs162.gif
Figure 11. Current Limit
TPS7A4001 tc_load_trans_bvs162.gif
Figure 2. Load Transient Response
TPS7A4001 tc_vfb_bvs162.png
Figure 4. Feedback Voltage
TPS7A4001 tc_ifb_bvs162.png
Figure 6. Feedback Current
TPS7A4001 tc_vdo_bvs162.png
Figure 8. Dropout Voltage
TPS7A4001 tc_noise_bvs162.png
Figure 10. Output Spectral Noise Density
TPS7A4001 tc_psrr_bvs162.png
Figure 12. Power-Supply Rejection Ratio