SCDA036A May   2022  – June 2024 TMUX8212

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Size Requirement
    1. 1.1 Optimized Layout and Control
  5. 2 Reliability Over Time
  6. 3 Power Consumption
  7. 4 Switching Speed and Hot Switching
  8. 5 Signal Isolation
  9. 6 Capacitance
  10. 7 On-Resistance and Flatness
  11. 8 Leakage Current
  12. 9 Integrated Protection
  13. 10Latch-up Immunity
  14. 11Galvanic Isolation
  15. 12Conclusion
  16. 13References
  17. 14Revision History

12 Conclusion

Though mechanical and Photorelays can be the conventional choice for many switching applications, TI’s integrated multiplexers have many strong advantages with minimal tradeoffs such as: a much smaller design size, excellent reliability, low power consumption, and fast switching speeds. Though it is important to consider the tradeoffs when it comes to leakage current, on-resistance flatness, and capacitance, as they relate to the system requirements. TI’s Flat On-Resistance multiplexers have bridged this gap significantly offering lower leakage currents and flatness, while integrating Latch-up immunity and overvoltage protection.

Table 12-1 Photorelay Replacement Recommended Devices
Signal Range Package Channel Density Leakage On-Resistance
Off-Capactiance		 Features
TMUXS7614DZEMR 4.5 V to 42 V
±4.5 V to ±25 V		 2.5mm2/ch 930 pA Ioff at 32.5V, 50C 1.3 Ω
27 pF
  • Integrated passives and decoupling capacitors
  • SPI control with daisy chain
  • Optimized layout/pinout
TMUX7612RUMR 4.5 V to 50 V
±4.5 V to ±25 V		 4.0mm2/ch 930 pA Ioff at 32.5V, 50C 1.3 Ω
27 pF
  • Over Temperature protection
TMUX8212RUMR 10 V to 100 V
±10 V to ±55 V		 4.0mm2/ch 4 nA Ioff at 95V, 85C 5 Ω
12 pF
  • -102 dB THD+N
TMUX7412FRRPR 8 V to 44 V
±5 V to ±22 V		 4.0mm2/ch 2 nA Ioff at 30V, 85C 8.3 Ω
12 pF
  • ±60 V Overvoltage and power off protection
TMUX6112RTER 10 V to 17 V
±8 V to ±17 V		 2.25mm2/ch 140 pA Ioff at 10V, 85C 120 Ω
3 pF		 -
TMUX1112RSVR 1.08 V to 5.5 V 0.6mm2/ch 300 pA Ioff at 10V, 85C 2 Ω
10 pF		 -