SCDU026 July   2021

 

  1.   Trademarks
  2. Introduction
  3. General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines
  4. Information About Cautions and Warnings
  5. Features
  6. TMUX-24PW-EVM Header Connections and Test Points
  7. TMUX-24PW-EVM Setup
  8. Layout
  9. Schematics
  10. Bill of Materials
  11. 10Revision History

TMUX-24PW-EVM Setup

GUID-20210706-CA0I-G6SR-HX7R-JBBDR4WVDR6P-low.pngFigure 6-1 DUT Footprint U1

The TMUX-24PW-EVM will not have any device connected at footprint U1, and there are not any devices included with the EVM for this footprint. Attach any compatible Texas Instruments TMUX device to this location, which will serve as the Device Under Test (DUT). Compatible devices include 24-pin parts with PW package names.

The headers of the TMUX-24PW-EVM can be easily connected to a power rail using 2.54 mm shunts on J1-J24. Connecting the shunt between pin 4 of the header and pin 3 (GND) to connect the corresponding pin of U1 to GND. Alternatively, the pins of U1 can be shorted to VDD or VSS by connecting between pin 4 of the header and pin 2 or pin 6 respectively. Figure 5-2 and Table 5-1 includes detailed descriptions of the connections on J1 through J24.

GUID-20210708-CA0I-7JS3-VPNW-QNTBRTFQPQTV-low.jpgFigure 6-2 Signal Line Circuitry (3D)

As shown in Figure 6-2 and Figure 6-3 as R4 and R16 on the J4 (pin 4 of U1) signal line, the TMUX-24PW-EVM includes 0 Ω series resistors (0805 package) on each signal line.

GUID-20210706-CA0I-QMJF-ZF8W-G98KCGTC09LN-low.pngFigure 6-3 Signal Line Circuitry

These can be substituted for different resistors as desired. Additionally, there are pads for pull-up and pull-down resistors to VDD and GND respectively. Add any 0603 resistor to the footprint shown as R4 to provide pull-up to VDD, and add any 0603 resistor to the footprint shown as R16 to provide pull-down to GND.

Each signal line also includes two footprints that allow for the user to attach capacitors or other devices with matching footprints. On the top side of the board, shown in Figure 6-2 and Figure 6-3 as C14, a standard 1206 footprint exists between the U1 pin signal and the GND signal. The user can solder a capacitor to this footprint to provide capacitance to the signal line.

GUID-20210706-CA0I-4MXS-DFCM-SPG1CG319G5J-low.pngFigure 6-4 Signal Line Circuitry Bottom Layer

On the back side of the board, shown in Figure 6-4 as C10, a standard 1812 footprint exists, also allowing for connection of a capacitor between the U1 pin signal and GND. The user can solder a capacitor to this footprint to provide capacitance to the signal line.