SCDU034 may   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Header and Jumper Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

Features

  • TMUX4827YBH pre-soldered on board
  • 2 power supply decoupling capacitor from VDD to Ground (1µF 0402; 0.1µF 0402)
  • 6 test points on I/O's supporting TMUX4827 full current capabilities
  • 7 additional GND test points for easy of probing
  • 1 3-pin header for connecting/disconnecting device from external power
  • 1 3-pin header to change signal path state of device