SFFS254 September   2021 TLV3603

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DCK Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DCK Package

1 Overview

This document contains information for TLV3603 (DCK package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

TLV3603 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

ADVANCE INFORMATION for preproduction products; subject to change without notice.