SFFS529 November   2022 TPSF12C1-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TPSF12C1-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TPSF12C1-Q1 pin diagram. For a detailed description of the device pins, please refer to the Pin Configuration and Functions section in the TPSF12C1-Q1 data sheet.

Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
NC 1, 3, 12 No impact D
VDD 2 AEF disabled B
SENSE1A 4 AEF degradation B
SENSE1B 5 AEF degradation B
SENSE2A 6 AEF degradation B
SENSE2B 7 AEF degradation B
EN 8 AEF disabled B
REFGND 9 Normal operation D
COMP1 10 No EMI filtering B
COMP2 11 No EMI filtering; damage to gain stage A
INJ 13 No EMI filtering; damage to gain stage A
IGND 14 Normal operation D
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
NC1, 3, 12No effect (normal operation)D
VDD2No EMI filteringB
SENSE1A4AEF degradationB
SENSE1B5AEF degradationB
SENSE2A6AEF degradationB
SENSE2B7AEF degradationB
EN8No effect (normal operation)B
REFGND9AEF degradationB
COMP110No EMI filteringB
COMP211No EMI filteringB
INJ13No EMI filteringB
IGND14AEF degradationB
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
NC 1 VDD No effect (normal operation) D
VDD 2 NC No effect (normal operation) D
NC 3 SENSE1 No effect (normal operation) B
SENSE1A 4 SENSE1B No effect (normal operation) B
SENSE1B 5 SENSE2A AEF degradation B
SENSE2A 6 SENSE2B No effect (normal operation) B
SENSE2B 7 EN N/A D
EN 8 REFGND No EMI filtering B
REFGND 9 COMP1 No EMI filtering B
COMP1 10 COMP2 No EMI filtering B
COMP2 11 NC No effect (normal operation) D
NC 12 INJ No effect (normal operation) D
INJ 13 IGND No EMI filtering; damage to gain stage A
IGND 14 NC No effect (normal operation) D
Table 4-5 Pin FMA for Device Pins Short-Circuited to VDD
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
NC 1, 3, 12 No effect (normal operation) D
VDD 2 No effect (normal operation) D
SENSE1A 4 AEF degradation; damage to sensing stage A
SENSE1B 5 AEF degradation; damage to sensing stage A
SENSE2A 6 AEF degradation; damage to sensing stage A
SENSE2B 7 AEF degradation; damage to sensing stage A
EN 8 AEF normal B
REFGND 9 AEF disabled B
COMP1 10 No EMI filtering; damage to COMP1 if VVDD > 5.5 V A
COMP2 11 No EMI filtering; damage to COMP2 if VVDD > 15 V A
INJ 13 No EMI filtering; damage to gain stage A
IGND 14 AEF disabled B