SFFS728 October 2023 OPA2333-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the OPA2333-Q1 (SOIC and VSSOP package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section: