SFFS911 December 2024 TMAG5110-Q1 , TMAG5111-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TMAG511x-Q1 (DBV package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2 and Table 4-6)
Pin open-circuited (see Table 4-3 and Table 4-7)
Pin short-circuited to an adjacent pin (see Table 4-4 and Table 4-8)
Pin short-circuited to VCC (see Table 4-5 and Table 4-9)

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

VCC and temperature are within the recommended operating conditions of the data sheet.
Pullup resistors on OUT1 and OUT2 to limit ISINK are within the recommended range, <10mA.