SLAA649G October   2014  – August 2021 MSP430F2001 , MSP430F2002 , MSP430F2003 , MSP430F2011 , MSP430F2012 , MSP430F2013 , MSP430F2013-EP , MSP430F2101 , MSP430F2111 , MSP430F2112 , MSP430F2121 , MSP430F2122 , MSP430F2131 , MSP430F2132 , MSP430F2232 , MSP430F2234 , MSP430F2252 , MSP430F2254 , MSP430F2272 , MSP430F2274 , MSP430F2274-EP , MSP430F233 , MSP430F2330 , MSP430F235 , MSP430F2350 , MSP430F2370 , MSP430F2410 , MSP430F2416 , MSP430F2417 , MSP430F2418 , MSP430F2419 , MSP430F247 , MSP430F2471 , MSP430F248 , MSP430F2481 , MSP430F249 , MSP430F249-EP , MSP430F2491 , MSP430F2616 , MSP430F2617 , MSP430F2618 , MSP430F2619 , MSP430F2619S-HT , MSP430FR2032 , MSP430FR2033 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430G2001 , MSP430G2101 , MSP430G2102 , MSP430G2111 , MSP430G2112 , MSP430G2121 , MSP430G2131 , MSP430G2132 , MSP430G2152 , MSP430G2153 , MSP430G2201 , MSP430G2202 , MSP430G2203 , MSP430G2210 , MSP430G2211 , MSP430G2212 , MSP430G2213 , MSP430G2221 , MSP430G2230 , MSP430G2230-EP , MSP430G2231 , MSP430G2231-EP , MSP430G2232 , MSP430G2233 , MSP430G2252 , MSP430G2253 , MSP430G2302 , MSP430G2302-EP , MSP430G2303 , MSP430G2312 , MSP430G2313 , MSP430G2332 , MSP430G2332-EP , MSP430G2333 , MSP430G2352 , MSP430G2353 , MSP430G2402 , MSP430G2403 , MSP430G2412 , MSP430G2413 , MSP430G2432 , MSP430G2433 , MSP430G2444 , MSP430G2452 , MSP430G2453 , MSP430G2513 , MSP430G2533 , MSP430G2544 , MSP430G2553 , MSP430G2744 , MSP430G2755 , MSP430G2855 , MSP430G2955 , MSP430I2020 , MSP430I2021 , MSP430I2030 , MSP430I2031 , MSP430I2040 , MSP430I2041

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Comparison of MSP430FR4xx and MSP430FR2xx Devices
  4. 3 In-System Programming of Nonvolatile Memory
    1. 3.1 Ferroelectric RAM (FRAM) Overview
    2. 3.2 FRAM Cell
    3. 3.3 Protecting FRAM Using the Memory Write Protection Bit
    4. 3.4 FRAM Memory Wait States
    5. 3.5 Bootloader (BSL)
    6. 3.6 JTAG and Security
    7. 3.7 Production Programming
  5. 4 Hardware Migration Considerations
  6. 5 Device Calibration Information
  7. 6 Important Device Specifications
  8. 7 Core Architecture Considerations
    1. 7.1 Power Management Module (PMM)
      1. 7.1.1 Core LDO and LPM3.5 LDO
      2. 7.1.2 SVS
      3. 7.1.3 VREF
      4. 7.1.4 Debug in Low-Power Mode
    2. 7.2 Clock System
      1. 7.2.1 DCO Frequencies
      2. 7.2.2 FLL, REFO, and DCO Tap
      3. 7.2.3 FRAM Access at 16 MHz, ADC Clock, and Clocks-on-Demand
    3. 7.3 Operating Modes, Wake-up Times, and Reset
      1. 7.3.1 LPMx.5
      2. 7.3.2 Reset
        1. 7.3.2.1 Behavior of POR and BOR
        2. 7.3.2.2 Reset Generation
        3. 7.3.2.3 Determining the Cause of Reset
    4. 7.4 Interrupt Vectors
    5. 7.5 FRAM and the FRAM Controller
      1. 7.5.1 Flash and FRAM Overview Comparison
      2. 7.5.2 Cache Architecture
  9. 8 Peripheral Considerations
    1. 8.1  Watchdog Timer
    2. 8.2  Ports
      1. 8.2.1 Digital Input/Output
      2. 8.2.2 Capacitive Touch I/O
    3. 8.3  Analog-to-Digital Converters
      1. 8.3.1 ADC10 to ADC
    4. 8.4  Communication Modules
      1. 8.4.1 USI to eUSCI
      2. 8.4.2 USCI to eUSCI
    5. 8.5  Timer and IR Modulation Logic
    6. 8.6  Backup Memory
    7. 8.7  Hardware Multiplier (MPY32)
    8. 8.8  RTC Counter
    9. 8.9  Interrupt Compare Controller (ICC)
    10. 8.10 LCD
    11. 8.11 Smart Analog Combo (SAC)
    12. 8.12 Comparator
  10. 9 ROM Libraries
  11. 10Conclusion
  12. 11References
  13. 12Revision History

8.2.2 Capacitive Touch I/O

The main difference in the capacitive touch implementation between the G2xx and the FR4xx lies in the selection of the port pins and the internal wiring of the capacitive touch I/O to the timer.

In the F2xx and G2xx devices with the pin oscillator feature, the selection of the pin oscillator is enabled with the PxSEL and PxSEL2 registers. In the FR4xx devices, there is one register, CAPTIO0CTL, to select a port and a specific pin in that port to be used as capacitive touch I/O.

For example, the CAPTIOPOSELx field in the Capacitive Touch IO x Control (CAPTIO0CTL) register can select port 1. The CAPTIOPISELx field in the same register can select pin 5. Hence, pin 1.5 is designated as a capacitive touch I/O.

For the CAPTIO0CTL register, the selected capacitive touch I/O is hard wired (internally connected) to a device-specific timer.

Note:

In the FR4xx family, some MCUs do not have the capacitive touch feature shared on GPIO pins. See the device-specific data sheet for details.