Differential 100 Ω co-planar wave guide for output traces is recommended.
Use short RF traces. Place DAC close to edge of PCB to shorten the length of output and clock traces. This helps to minimize PCB loss and coupling
Stitch the ground plane with ground vias uniformly along the output trace.
Avoid width/spacing differences when entering a landing pad (eg. a balun) by tapering or by redefining width/space rules for the traces
Power supply planes
Ensure sufficient lateral spacing between two power planes (about 3x the thickness of the plane is recommended)
Insert ground plane between adjacent power planes where possible
Figure 150. Example Power Plane Routing
Bypass Capacitors
Use bypass capacitors with in-pad vias and place between the pin and the power plane. Avoid sharing ground vias or pads of bypass caps used for different power rails
Minimize stubs on bypass capacitors to avoid parasitic inductance
Figure 151. Bypass Capacitors Placed on the Power Supply Pin With In-pad Vias
High speed SerDes traces
Route all SerDes traces straight and minimized sharp curves or serpentines. Route for best signal integrity
Some skew between SerDes traces can be tolerated. It is recommended to limit skew between traces to 320ps or less
Place ground planes between the SerDes traces for improved isolation
Figure 152. Layout Example of High Speed SerDes Traces