SLASEJ5B October   2017  – January 2020

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Gated Output (Gx)
      3. 7.3.3 Register Clear (CLR)
      4. 7.3.4 Open-Drain Outputs and Flexible Diagnostics Channel
        1. 7.3.4.1 Configurable Outputs
        2. 7.3.4.2 LED-Open Diagnostics
        3. 7.3.4.3 LED-Short Diagnostics
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Command Error
      7. 7.3.7 Serial Communication Error
      8. 7.3.8 Error Feedback
      9. 7.3.9 Interface
        1. 7.3.9.1 Register Write
        2. 7.3.9.2 Register Read
        3. 7.3.9.3 Shift-Register Communication-Fault Detection
        4. 7.3.9.4 Clear Register
        5. 7.3.9.5 Register Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 POR Reset
      3. 7.4.3 Standby Mode
    5. 7.5 Register Maps
    6. 7.6 Interface Registers
      1. 7.6.1 Configuration Register (Offset = 0h) [reset = 0h]
        1. Table 5. Configuration Register Field Descriptions
      2. 7.6.2 Fault Readback Register (Offset = 1h) [reset = 0h]
        1. Table 6. Fault Readback Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TLC6C5816-Q1 UNIT
PWP (HTSSOP)
28 PINS
RθJA Junction-to-ambient thermal resistance 44.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.9 °C/W
RθJB Junction-to-board thermal resistance 26.9 °C/W
ψJT Junction-to-top characterization parameter 2 °C/W
ψJB Junction-to-board characterization parameter 26.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.