SLAU533D September 2013 – April 2017
Table 4 lists the changes to the MSP-EXP430F5529LP hardware.
PCB Revision | Description |
---|---|
Rev 1.4 | Initial release |
Rev 1.5 | Removed TPS2041B power switches.
Changed to sturdier BoosterPack plug-in module male header pins |
Rev 1.6 | Updated some pad dimensions for manufacturing.
Changed mounting holes to 125 mil. |
Rev 1.7 | Changed Q2 crystal to X1A0001410014.
Updated rear silkscreen to current LaunchPad development kit standards. Added CE marking to silkscreen. |