SLAU678C March   2016  – November 2022

 

  1.   Abstract
  2.   Trademarks
  3. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 First Steps: Out-of-Box Experience
      1. 1.4.1 Connecting to the Computer
      2. 1.4.2 Running the Out-of-Box Demo
        1. 1.4.2.1 Live Temperature Mode
        2. 1.4.2.2 FRAM Data Log Mode
        3. 1.4.2.3 SD Card Data Log Mode
    5. 1.5 Next Steps: Looking Into the Provided Code
  4. 2Hardware
    1. 2.1 Block Diagram
    2. 2.2 Hardware Features
      1. 2.2.1 MSP430FR5994 MCU
      2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace++ Technology
      3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
      4. 2.2.4 Application (or Backchannel) UART
      5. 2.2.5 Special Features
        1. 2.2.5.1 microSD Card
        2. 2.2.5.2 220-mF Super Capacitor
    3. 2.3 Power
      1. 2.3.1 eZ-FET USB Power
      2. 2.3.2 BoosterPack Plug-in Module and External Power Supply
      3. 2.3.3 Super Cap (C1)
        1. 2.3.3.1 Charging the Super Cap
        2. 2.3.3.2 Using the Super Cap
        3. 2.3.3.3 Disabling the Super Cap
    4. 2.4 Measure MSP430 Current Draw
    5. 2.5 Clocking
    6. 2.6 Using the eZ-FET Debug Probe With a Different Target
    7. 2.7 BoosterPack Plug-in Module Pinout
    8. 2.8 Design Files
      1. 2.8.1 Hardware
      2. 2.8.2 Software
    9. 2.9 Hardware Change Log
  5. 3Software Examples
    1. 3.1 Out-of-Box Software Example
      1. 3.1.1 Source File Structure
      2. 3.1.2 Out-of-Box Demo GUI
      3. 3.1.3 Power Up and Idle
      4. 3.1.4 Live Temperature Mode
      5. 3.1.5 FRAM Log Mode
      6. 3.1.6 SD Card Log Mode
    2. 3.2 Blink LED Example
      1. 3.2.1 Source File Structure
    3. 3.3 BOOSTXL-AUDIO Audio Record and Playback Example
      1. 3.3.1 Source File Structure
      2. 3.3.2 Operation
    4. 3.4 Filtering and Signal Processing With LEA Reference Design Example
      1. 3.4.1 Source File Structure
      2. 3.4.2 Operation
    5. 3.5 Emulating EEPROM Reference Design Example
      1. 3.5.1 Source File Structure
      2. 3.5.2 Operation
  6. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
        1. 4.1.1.1 TI Resource Explorer Cloud
        2. 4.1.1.2 Code Composer Studio Cloud
      2. 4.1.2 Code Composer Studio™ IDE
      3. 4.1.3 IAR Embedded Workbench for MSP430
    2. 4.2 LaunchPad Websites
    3. 4.3 MSPWare and TI Resource Explorer
    4. 4.4 FRAM Utilities
      1. 4.4.1 Compute Through Power Loss (CTPL)
    5. 4.5 MSP430FR5994 MCU
      1. 4.5.1 Device Documentation
      2. 4.5.2 MSP430FR5994 Code Examples
      3. 4.5.3 MSP430 Application Notes and TI Reference Designs
    6. 4.6 Community Resources
      1. 4.6.1 TI E2E Support Forums
      2. 4.6.2 Community at Large
  7. 5FAQ
  8. 6Schematics
  9. 7Revision History

2.6 Using the eZ-FET Debug Probe With a Different Target

The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative devices, not just the onboard MSP430FR5994 target device.

To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.

Next, make sure the target board has proper connections for SBW. To be compatible with SBW, the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430 JTAG interface circuitry is the MSP430 Hardware Tools User's Guide.

Finally, wire together these signals from the debug probe side of the isolation jumper block to the target hardware:

  • 5 V (if 5 V is needed)
  • 3.3 V
  • GND
  • SBWTDIO
  • SBWTCK
  • TXD (if the UART backchannel is to be used)
  • RXD (if the UART backchannel is to be used)

This wiring can be done either with jumper wires or by designing the board with a connector that plugs into the isolation jumper block.