SLAU873C January   2023  – January 2024

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What's Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 Software Examples
    4. 1.4 First Step: Out-of-Box Experience
      1. 1.4.1 Connecting to the Computer
      2. 1.4.2 Running the Out-of-Box Experience
    5. 1.5 Next Steps: Looking Into the Provided Code
  5. 2Hardware
    1. 2.1 Jumper Map
    2. 2.2 Block Diagram
    3. 2.3 Hardware Features
      1. 2.3.1 MSPM0G3507 MCU
      2. 2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      3. 2.3.3 Debug Probe Connection Isolation Jumper Block
      4. 2.3.4 Application (or Backchannel) UART
      5. 2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
      6. 2.3.6 Using the XDS110-ET Debug Probe With a Different Target
      7. 2.3.7 Special Features
        1. 2.3.7.1 Up to 4-Msps High-Speed Analog-to-Digital Converter
        2. 2.3.7.2 Thermistor
        3. 2.3.7.3 Light Sensor
    4. 2.4 Power
      1. 2.4.1 XDS110-ET USB Power
    5. 2.5 External Power Supply and BoosterPack Plug-in Module
    6. 2.6 Measure Current Draw of the MSPM0 MCU
    7. 2.7 Clocking
    8. 2.8 BoosterPack Plug-in Module Pinout
  6. 3Software Examples
  7. 4Resources
    1. 4.1 Integrated Development Environments
      1. 4.1.1 TI Cloud Development Tools
      2. 4.1.2 TI Resource Explorer Cloud
      3. 4.1.3 Code Composer Studio Cloud
      4. 4.1.4 Code Composer Studio IDE
    2. 4.2 MSPM0 SDK and TI Resource Explorer
    3. 4.3 MSPM0G3507 MCU
      1. 4.3.1 Device Documentation
      2. 4.3.2 MSPM0G3507 Code Examples
    4. 4.4 Community Resources
      1. 4.4.1 TI E2E™ Forums
  8. 5Schematics
  9. 6Revision History

1.1 Introduction

The MSPM0G3507 is Arm® 32-bit Cortex®-M0+ CPU with a memory protection unit and frequency up to 80MHz. The device features 128KB of embedded flash memory combined with 32KB of on-chip RAM. The integrated high-performance analog peripherals include two 12-bit 4-Msps SAR ADCs, two zero-drift chopper op-amps (OPA), and one general-purpose amplifier (GPAMP) to help users design their system.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers.

Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded Workbench™ IDE, and Keil® µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology when paired with the MSPM0G3507 LaunchPad™ development kit. Developer can easily measure the power consumption of their applications. More information about the LaunchPad development kit, the supported BoosterPack™ plug-in modules, and the available resources can be found at TI's LaunchPad development kit portal. To get started quickly and find available resources in the MSPM0 software development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

See the MSPM0 Quick Reference Guide for more resources surrounding MSPM0 devices.