SLAU892A March   2023  – June 2024 AFE11612-SEP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Hardware Setup
      1. 2.1.1 Electrostatic Discharge Caution
      2. 2.1.2 Power Configurations and Jumper Settings
      3. 2.1.3 Connecting the Hardware
    2. 2.2 Hardware Description
      1. 2.2.1 Theory of Operation
        1. 2.2.1.1 Signal Definitions
  7. 3Software
    1. 3.1 Software Setup
      1. 3.1.1 Operating Systems
      2. 3.1.2 Software Installation
    2. 3.2 Software Description
      1. 3.2.1 Starting the Software
      2. 3.2.2 Software Features
        1. 3.2.2.1 High Level Configuration Page
          1. 3.2.2.1.1 DACs Subpage
          2. 3.2.2.1.2 ADCs Subpage
          3. 3.2.2.1.3 Alarms Subpage
          4. 3.2.2.1.4 GPIO + Temp Subpage
        2. 3.2.2.2 Low Level Configuration Page
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Related Documentation from Texas Instruments
  11. 7Revision History

1.4 Device Information

The AFE11612-SEP is a highly integrated analog monitor and control device designed for high-density, general-purpose monitor and control systems. The device includes 12 12-bit digital-to-analog converters (DACs) and a 16-channel, 12-bit, analog-to-digital converter (ADC). The device also incorporates eight general-purpose inputs and outputs (GPIOs), two remote temperature sensor channels, and a local temperature sensor channel.

The device has an internal 2.5V reference that sets the DAC to an output voltage range of 0V to 5V. The device also supports operation from an external reference. The device supports communication through both SPI-compatible and I2Ccompatible interfaces.

The device high level of integration significantly reduces component count and simplifies closed-loop system design, thus making the device a great choice for high-density applications where radiation-tolerance and board space are critical.