SLAU899 August 2023
Table 4-1 lists the bill of materials (BOM) for the ISOM8110DFGEVM.
Item # | Designator | Manufacturer | Description |
---|---|---|---|
1 | C3 | TDK | CAP, CERM, 1uF, 50V, +/- 10%, X5R, 0603 |
2 | H1, H2, H3, H4 | 3M | Bumpon, Hemisphere, 0.44 X 0.20, Clear |
3 | J1 | Phoenix Contact | Conn Term Block, 2POS, 3.5mm, TH |
4 | J2, J3, J4 | Samtec | Connector Header Surface Mount 2 position 0.100" (2.54mm) |
5 | J5 | Samtec | Connector Header Surface Mount 4 position 0.100" (2.54mm) |
6 | J6 | Phoenix Contact | Terminal Block, 4x1, 2.54mm, Green, TH |
7 | Q1 | Texas Instruments | 3.75-kVRMS, Single-Channel Opto-Emulator with Transistor Output |
8 | R1, R3, R4 | Panasonic | RES, 1.00 k, 1%, 0.25 W, 0805 |
9 | R2 | Yageo America | RES, 0, 5%, 0.125 W, 0805 |
10 | SH-J1 | Samtec | Shunt, 100mil, Gold plated, Black |
11 | TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8 | Keystone | Test Point, Miniature, SMT |
12 | C1 | Yageo America | CAP, CERM, 15pF, 50V, +/- 5%, C0G/NP0, 0805 |
13 | C2 | MuRata | CAP, CERM, 15pF, 50V, +/- 5%, C0G/NP0, AEC-Q200 Grade 1, 0603 |