SLCA004 February   2023 LM2901 , LM2901AV , LM2901B , LM2901V

 

  1. 1 LM2901, LM2901B, LM2901V, LM2901AV Functional Safety FIT Rate, FMD and Pin FMA
    1. 1.1 Overview
    2. 1.2 Functional Safety Failure In Time (FIT) Rates
    3. 1.3 Failure Mode Distribution (FMD)
    4. 1.4 Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the LM2901, LM2901B, LM2901V, LM2901AV. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 1-5)
  • Pin open-circuited (see Table 1-6)
  • Pin short-circuited to an adjacent pin (see Table 1-7)
  • Pin short-circuited to supply (see Table 1-8)

Table 1-5 through Table 1-8 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 1-4.

Table 1-4 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 1-2 shows the LM2901-Q1, LM2901B-Q1, LM2901V-Q1, LM2901AV-Q1 pin diagram. For a detailed description of the device pins please refer to the 'Pin Configuration and Functions' section in the data sheet.

GUID-479CE4A8-20F0-4791-B5C9-4C7B8D0202D2-low.gifFigure 1-2 Pin Diagram
Table 1-5 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class

1OUT

1

No change if GND pin is GND node B

2OUT

2

No change if GND pin is GND node B

VCC

3

Main supply shorted out (no power to device) B

2IN-

4

Output goes high, if other input is positive B

2IN+

5

Output goes low, if other input is positive B

1IN-

6

Output goes high, if other input is positive B

1IN+

7

Output goes low, if other input is positive B

3IN-

8

Output goes high, if other input is positive B

3IN+

9

Output goes low, if other input is positive B

4IN-

10

Output goes high, if other input is positive B

4IN+

11

Output goes low, if other input is positive B

GND

12

No change if same node as GND D

4OUT

13

No change if GND pin is GND node B

3OUT

14

No change if GND pin is GND node B
Table 1-6 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class

1OUT

1

Output can't drive application load B

2OUT

2

Output can't drive application load B

VCC

3

Main supply open (no power to device) B

2IN-

4

Output may be low or high B

2IN+

5

Output may be low or high B

1IN-

6

Output may be low or high B

1IN+

7

Output may be low or high B

3IN-

8

Output may be low or high B

3IN+

9

Output may be low or high B

4IN-

10

Output may be low or high B

4IN+

11

Output may be low or high B

GND

12

Lowest voltage pin will drive GND pin internally (via diode) A

4OUT

13

Output can't drive application load B

3OUT

14

Output can't drive application load B
Table 1-7 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class

1OUT

1

2OUT

Output may be low or high B

2OUT

2

VCC

Thermal stress due to high power dissipation A

VCC

3

2IN-

Output goes low, if other input is less positive B

2IN-

4

2IN+

Output may be low or high B

2IN+

5

1IN-

Output may be low or high B

1IN-

6

1IN+

Output may be low or high B

1IN+

7

3IN-

Output may be low or high B

3IN-

8

3IN+

Output may be low or high B

3IN+

9

4IN-

Output may be low or high B

4IN-

10

4IN+

Output may be low or high B

4IN+

11

GND

Output goes low, if other input is positive B

GND

12

4OUT

No change if GND pin is GND node B

4OUT

13

3OUT

Output may be low or high B

3OUT

14

1OUT

Output may be low or high B
Table 1-8 Pin FMA for Device Pins Short-Circuited to Supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class

1OUT

1

Thermal stress due to high power dissipation A

2OUT

2

Thermal stress due to high power dissipation A

VCC

3

No change if same node as VCC D

2IN-

4

Output goes low, if other input is less positive B

2IN+

5

Output goes high, if other input is less positive B

1IN-

6

Output goes low, if other input is less positive B

1IN+

7

Output goes high, if other input is less positive B

3IN-

8

Output goes low, if other input is less positive B

3IN+

9

Output goes high, if other input is less positive B

4IN-

10

Output goes low, if other input is less positive B

4IN+

11

Output goes high, if other input is less positive B

GND

12

Main supply shorted out (no power to device) B

4OUT

13

Thermal stress due to high power dissipation A

3OUT

14

Thermal stress due to high power dissipation A