SLLSEF7 March   2014 TUSB8020B-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Terminal Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 3.3-V I/O Electrical Characteristics
    6. 7.6 Power-Up Timing Requirements
    7. 7.7 Hub Input Supply Current
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Battery Charging Features
      2. 8.3.2 USB Power Management
      3. 8.3.3 One Time Programmable (OTP) Configuration
      4. 8.3.4 Clock Generation
        1. 8.3.4.1 Crystal Requirements
        2. 8.3.4.2 Input Clock Requirements
      5. 8.3.5 Power Up and Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Configuration Interface
      2. 8.4.2 I2C EEPROM Operation
      3. 8.4.3 SMBus Slave Operation
    5. 8.5 Register Maps
      1. 8.5.1 Configuration Registers
        1. 8.5.1.1  ROM Signature Register
        2. 8.5.1.2  Vendor ID LSB Register
        3. 8.5.1.3  Vendor ID MSB Register
        4. 8.5.1.4  Product ID LSB Register
        5. 8.5.1.5  Product ID MSB Register
        6. 8.5.1.6  Device Configuration Register
        7. 8.5.1.7  Battery Charging Support Register
        8. 8.5.1.8  Device Removable Configuration Register
        9. 8.5.1.9  Port Used Configuration Register
        10. 8.5.1.10 PHY Custom Configuration Register
        11. 8.5.1.11 Device Configuration Register 2
        12. 8.5.1.12 UUID Registers
        13. 8.5.1.13 Language ID LSB Register
        14. 8.5.1.14 Language ID MSB Register
        15. 8.5.1.15 Serial Number String Length Register
        16. 8.5.1.16 Manufacturer String Length Register
        17. 8.5.1.17 Product String Length Register
        18. 8.5.1.18 Serial Number Registers
        19. 8.5.1.19 Manufacturer String Registers
        20. 8.5.1.20 Product String Registers
        21. 8.5.1.21 Additional Feature Configuration Register
        22. 8.5.1.22 Charging Port Control Register
        23. 8.5.1.23 Device Status and Command Register
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Upstream Port Implementation
        2. 9.2.2.2 Downstream Port 1 Implementation
        3. 9.2.2.3 Downstream Port 2 Implementation
        4. 9.2.2.4 VBUS Power Switch Implementation
        5. 9.2.2.5 Clock, Reset, and Misc
        6. 9.2.2.6 Power Implementation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply
    2. 10.2 Downstream Port Power
    3. 10.3 Ground
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Placement
      2. 11.1.2 Package Specific
      3. 11.1.3 Differential Pairs
    2. 11.2 Layout Example
      1. 11.2.1 Upstream Port
      2. 11.2.2 Downstream Port
      3. 11.2.3 Thermal Pad
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

12 Device and Documentation Support

12.1 Trademarks

All other trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.