SLLSF21D September   2018  – February  2020

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics: Driver
    10. 6.10 Electrical Characteristics: Receiver
    11. 6.11 Supply Current Characteristics: Side 1(ICC1)
    12. 6.12 Supply Current Characteristics: Side 2(ICC2)
    13. 6.13 Switching Characteristics: Driver
    14. 6.14 Switching Characteristics: Receiver
    15. 6.15 Insulation Characteristics Curves
    16. 6.16 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 8.3.2 Failsafe Receiver
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Glitch-Free Power Up and Power Down
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate and Bus Length
        2. 9.2.2.2 Stub Length
        3. 9.2.2.3 Bus Loading
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

10 Power Supply Recommendations

To make sure device operation is reliable at all data rates and supply voltages, a 0.1-μF bypass capacitor is recommended at the logic and transceiver supply pins (VCC1 and VCC2). The capacitors should be placed as near to the supply pins as possible. Side 2 requires one VCC2 decoupling capacitor on each VCC2 pin. If only one primary-side power supply is available in an application, isolated power can be generated for the secondary-side with the help of a transformer driver such as TI's SN6505B device. For such applications, detailed power supply design and transformer selection recommendations are available in the SN6505 Low-Noise 1-A Transformer Drivers for Isolated Power Supplies data sheet.