SLLU388 November   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1  Power Requirements
    2. 2.2  Setup
      1. 2.2.1 Power Management Setup
      2. 2.2.2 Transceiver Options
      3. 2.2.3 Special Use Pin Options
      4. 2.2.4 Potential Board Modifications
    3. 2.3  Header, Jumper, and other Interface Information
    4. 2.4  Switch Information
    5. 2.5  Resistor Information
    6. 2.6  Inductance Information
    7. 2.7  Capacitor Information
    8. 2.8  Diode Information
    9. 2.9  Transistor Information
    10. 2.10 IC and Misc. Component Information
  9. 3Software
    1. 3.1 Software Description
    2. 3.2 Software Installation
    3. 3.3 Software Development
    4. 3.4 Programming Options
  10. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Trademarks
    2. 5.2 Related Documentation

1.3 Specification

This board closely follows the TCAN284xx and TCAN285xx family of devices limiting factors and recommended operating conditions. The temperature conditions do no imply that the board generates that much heat. The IC and board components can withstand higher heat.

Operational Parameter Description Min Typical Max Unit
VSUP Supply Voltage 4.5 - 28 V
VHSS HSS Supply Voltage 5 - 28 V
VCAN CAN Transceiver Supply Voltage 4.5 - 5.5 V
V_LIN LIN Bus Input Voltage (TCAN28X7X Only) 0 - 28 V
V_CANBUS CAN Bus Voltage (Absolute Max/Min) -58 - 58 V
V_LOGIC Logic Pin Voltage (Absolute Max/Min) -0.3 - 6 V
IOH(DO) Digital Output Current High Level -2 - - mA
IOL(DO) Digital Output Current Low Level - - 2 mA
IO(LIMP) LIMP Pin Current when Configured as LIMP - - 6 mA
IO(HSSx) HSS Pin Current - 60 100 mA
IO(VCC1) Output Current VCC1 - - 250 mA
IO(VCC2) Output Current VCC2 - - 200 mA
IO(VEXCC) Output Current VEXCC - - 350 mA
TSDWR Thermal Shutdown Waring 145 - 165 C
TSDWF Thermal Shutdown Waring Release 130 - 155 C
TSDR Thermal Shutdown 165 - 200 C
TSDF Thermal Shutdown Release 155 - 190 C
TJ Junction Temperature -40 - 150 C