SLUSAP5A December   2011  – November 2016 TPS53316

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overcurrent and Frequency Setting
      2. 7.3.2 Soft-Start Operation
      3. 7.3.3 Power Good
      4. 7.3.4 UVLO Function
      5. 7.3.5 Overcurrent Protection
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Undervoltage Protection
      8. 7.3.8 Overtemperature Protection
      9. 7.3.9 Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Forced Continuous Conduction Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Determine the Value of R1 and R2
        2. 8.2.2.2 Choose the Inductor
        3. 8.2.2.3 Choose the Output Capacitor(s)
        4. 8.2.2.4 Choose the Input Capacitors
        5. 8.2.2.5 Compensation Design
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Layout

Layout Guidelines

Good layout is essential for stable power supply operation. Follow these guidelines for an efficient PCB layout:

  • Separate the power ground and analog ground. Connect analog ground to GND plane with single via or a 0-Ω resistor at a quiet place.
  • Use 4 vias to connect the thermal pad to power ground.
  • Place VIN and VREG3 decoupling capacitors as close to the device as possible.
  • Use wide traces for VIN, VOUT, PGND and SW. These nodes carry high-current and also serve as heat sinks.
  • Place feedback and compensation components as close to the device as possible.
  • Keep analog signals (FB, COMP) away from noisy signals (SW, VBST).
  • See 5-A Step-Down Regulator with Integrated Switcher (SLUU671) for a layout example.

Layout Example

TPS53316 v11270_lusap5.gif Figure 54. Layout Recommendation