SLUSB23B October   2012  – June 2015 BQ27425-G2A , BQ27425-G2B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Power-On Reset
    6. 7.6  2.5-V LDO Regulator
    7. 7.7  Integrating ADC (Coulomb Counter) Characteristics
    8. 7.8  Integrated Sense Resistor Characteristics
    9. 7.9  ADC (Temperature and Cell Measurement) Characteristics
    10. 7.10 EEPROM Memory Characteristics
    11. 7.11 Timing Requirements: I2C-Compatible Interface Communication
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fuel Gauging
      2. 8.3.2 Fuel Gauging Configurations
        1. 8.3.2.1 SOC Smoothing Feature
      3. 8.3.3 GPOUT Pin
      4. 8.3.4 Battery Detection (BIN)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
        1. 8.4.1.1 POR and INITIALIZATION Modes
        2. 8.4.1.2 CONFIG UPDATE Mode
        3. 8.4.1.3 NORMAL Mode
        4. 8.4.1.4 SLEEP Mode
        5. 8.4.1.5 HIBERNATE Mode
    5. 8.5 Programming
      1. 8.5.1 Standard Data Commands
        1. 8.5.1.1  Control(): 0x00 and 0x01
          1. 8.5.1.1.1  CONTROL_STATUS: 0x0000
          2. 8.5.1.1.2  DEVICE_TYPE: 0x0001
          3. 8.5.1.1.3  FW_VERSION: 0x0002
          4. 8.5.1.1.4  PREV_MACWRITE: 0x0007
          5. 8.5.1.1.5  CHEM_ID: 0x0008
          6. 8.5.1.1.6  BAT_INSERT: 0X000C
          7. 8.5.1.1.7  BAT_REMOVE: 0X000D
          8. 8.5.1.1.8  SET_HIBERNATE: 0x0011
          9. 8.5.1.1.9  CLEAR_HIBERNATE: 0x0012
          10. 8.5.1.1.10 SET_CFGUPDATE: 0x0013
          11. 8.5.1.1.11 SEALED: 0x0020
          12. 8.5.1.1.12 RESET: 0x0041
          13. 8.5.1.1.13 SOFT_RESET: 0x0042
        2. 8.5.1.2  Temperature( ): 0x02 and 0x03
        3. 8.5.1.3  Voltage( ): 0x04 and 0x05
        4. 8.5.1.4  Flags( ): 0x06 and 0x07
        5. 8.5.1.5  NominalAvailableCapacity( ): 0x08 and 0x09
        6. 8.5.1.6  FullAvailableCapacity( ): 0x0A and 0x0B
        7. 8.5.1.7  RemainingCapacity( ): 0x0C and 0x0D
        8. 8.5.1.8  FullChargeCapacity( ): 0x0E and 0x0F
        9. 8.5.1.9  AverageCurrent( ): 0x10 and 0x11
        10. 8.5.1.10 AveragePower( ): 0x18 and 0x19
        11. 8.5.1.11 StateOfCharge( ): 0x1C and 0x1D
        12. 8.5.1.12 IntTemperature( ): 0x1E and 0x1F
        13. 8.5.1.13 StateOfHealth( ): 0x20 and 0x21
        14. 8.5.1.14 OperationConfiguration( ): 0x3A and 0x3B
        15. 8.5.1.15 DesignCapacity( ): 0x3C and 0x3D
        16. 8.5.1.16 DebugX( ):
      2. 8.5.2 Extended Data Commands
        1. 8.5.2.1 OperationConfiguration( ): 0x3A and 0x3B
        2. 8.5.2.2 DesignCapacity( ): 0x3C and 0x3D
        3. 8.5.2.3 DataClass( ): 0x3E
        4. 8.5.2.4 DataBlock( ): 0x3F
        5. 8.5.2.5 BlockData( ): 0x40 through 0x5F
        6. 8.5.2.6 BlockDataChecksum( ): 0x60
        7. 8.5.2.7 BlockDataControl( ): 0x61
        8. 8.5.2.8 Reserved: 0x62 through 0x7F
      3. 8.5.3 Block Data Interface
        1. 8.5.3.1 Accessing Block Data
      4. 8.5.4 Access Modes
        1. 8.5.4.1 Sealing and Unsealing Data Blocks
      5. 8.5.5 Data Block Summary
      6. 8.5.6 Detecting Charge Termination
      7. 8.5.7 Communications
        1. 8.5.7.1 I2C Interface
        2. 8.5.7.2 I2C Time Out
        3. 8.5.7.3 I2C Command Waiting Time
        4. 8.5.7.4 I2C Clock Stretching
    6. 8.6 Register Maps
      1. 8.6.1 Operation Configuration (Op Config) Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT/REGIN Voltage Sense Input
        2. 9.2.2.2 Integrated LDO Capacitor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging
      1. 13.1.1 Package Dimensions

12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 Trademarks

Impedance Track, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.