SLUUBW5A July   2018  – September 2021 BQ34Z100-G1

 

  1. 1 Read This First
    1. 1.1 About This Manual
    2. 1.1 Notational Conventions
    3. 1.1 Glossary
    4. 1.1 Trademarks
  2. 1 Introduction
  3. 2 Data Commands
    1. 2.1 Standard Data Commands
      1. 2.1.1  Control(): 0x00/0x01
        1. 2.1.1.1  CONTROL_STATUS: 0x0000
        2. 2.1.1.2  DEVICE TYPE: 0x0001
        3. 2.1.1.3  FW_VERSION: 0x0002
        4. 2.1.1.4  HW_VERSION: 0x0003
        5. 2.1.1.5  RESET_DATA: 0x0005
        6. 2.1.1.6  PREV_MACWRITE: 0x0007
        7. 2.1.1.7  CHEM ID: 0x0008
        8. 2.1.1.8  BOARD_OFFSET: 0x0009
        9. 2.1.1.9  CC_OFFSET: 0x000A
        10. 2.1.1.10 CC_OFFSET_SAVE: 0x000B
        11. 2.1.1.11 DF_VERSION: 0x000C
        12. 2.1.1.12 SET_FULLSLEEP: 0x0010
        13. 2.1.1.13 STATIC_CHEM_DF_CHKSUM: 0x0017
        14. 2.1.1.14 SEALED: 0x0020
        15. 2.1.1.15 IT ENABLE: 0x0021
        16. 2.1.1.16 CAL_ENABLE: 0x002D
        17. 2.1.1.17 RESET: 0x0041
        18. 2.1.1.18 EXIT_CAL: 0x0080
        19. 2.1.1.19 ENTER_CAL: 0x0081
        20. 2.1.1.20 OFFSET_CAL: 0x0082
      2. 2.1.2  StateOfCharge(): 0x02
      3. 2.1.3  MaxError(): 0x03
      4. 2.1.4  RemainingCapacity(): 0x04/0x05
      5. 2.1.5  FullChargeCapacity(): 0x06/07
      6. 2.1.6  Voltage(): 0x08/0x09
      7. 2.1.7  AverageCurrent(): 0x0A/0x0B
      8. 2.1.8  Temperature(): 0x0C/0x0D
      9. 2.1.9  Flags(): 0x0E/0x0F
      10. 2.1.10 FlagsB(): 0x12/0x13
      11. 2.1.11 Current(): 0x10/0x11
    2. 2.2 Extended Data Commands
      1. 2.2.1  AverageTimeToEmpty(): 0x18/0x19
      2. 2.2.2  AverageTimeToFull(): 0x1A/0x1B
      3. 2.2.3  PassedCharge(): 0x1C/0x1D
      4. 2.2.4  DOD0Time(): 0x1E/0x1F
      5. 2.2.5  AvailableEnergy(): 0x24/0x25
      6. 2.2.6  AveragePower(): 0x26/0x27
      7. 2.2.7  SerialNumber(): 0x28/0x29
      8. 2.2.8  InternalTemperature(): 0x2A/0x2B
      9. 2.2.9  CycleCount(): 0x2C/0x2D
      10. 2.2.10 StateOfHealth(): 0x2E/0x2F
      11. 2.2.11 ChargeVoltage(): 0x30/0x31
      12. 2.2.12 ChargeCurrent(): 0x32/0x33
      13. 2.2.13 PackConfiguration(): 0x3A/0x3B
      14. 2.2.14 DesignCapacity(): 0x3C/0x3D
      15. 2.2.15 DataFlashClass(): 0x3E
      16. 2.2.16 DataFlashBlock(): 0x3F
      17. 2.2.17 AuthenticateData/BlockData(): 0x40…0x53
      18. 2.2.18 AuthenticateChecksum/BlockData(): 0x54
      19. 2.2.19 BlockData(): 0x55…0x5F
      20. 2.2.20 BlockDataChecksum(): 0x60
      21. 2.2.21 BlockDataControl(): 0x61
      22. 2.2.22 GridNumber(): 0x62
      23. 2.2.23 LearnedStatus(): 0x63
      24. 2.2.24 Dod@Eoc(): 0x64/0x65
      25. 2.2.25 QStart(): 0x66/0x67
      26. 2.2.26 TrueRC(): 0x68/0x69
      27. 2.2.27 TrueFCC(): 0x6A/0x6B
      28. 2.2.28 StateTime(): 0x6C/0x6D
      29. 2.2.29 QmaxPassedQ(): 0x6E/0x6F
      30. 2.2.30 DOD0(): 0x70/0x71
      31. 2.2.31 QmaxDod0(): 0x72/0x73
      32. 2.2.32 QmaxTime(): 0x74/0x75
      33. 2.2.33 Data Flash Interface
        1. 2.2.33.1 Accessing Data Flash
        2. 2.2.33.2 Manufacturer Information Block
        3. 2.2.33.3 Access Modes
        4. 2.2.33.4 Sealing/Unsealing Data Flash Access
  4. 3 Fuel Gauging
    1. 3.1  Overview
    2. 3.2  Impedance Track Variables
      1. 3.2.1  Load Mode
      2. 3.2.2  Load Select
      3. 3.2.3  Reserve Cap-mAh
      4. 3.2.4  Reserve Cap-mWh/cWh
      5. 3.2.5  Design Energy Scale
      6. 3.2.6  Dsg Current Threshold
      7. 3.2.7  Chg Current Threshold
      8. 3.2.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
      9. 3.2.9  Qmax
      10. 3.2.10 Update Status
      11. 3.2.11 Avg I Last Run
      12. 3.2.12 Avg P Last Run
      13. 3.2.13 Cell Delta Voltage
      14. 3.2.14 Ra Tables
      15. 3.2.15 StateOfCharge() Smoothing
      16. 3.2.16 Charge Efficiency
      17. 3.2.17 Lifetime Data Logging
    3. 3.3  Device Configuration
      1. 3.3.1 Pack Configuration Register
      2. 3.3.2 Pack Configuration B Register
      3. 3.3.3 Pack Configuration C Register
    4. 3.4  Voltage Measurement and Calibration
      1. 3.4.1 1S Example
      2. 3.4.2 7S Example
      3. 3.4.3 Autocalibration
    5. 3.5  Temperature Measurement
    6. 3.6  Overtemperature Indication
      1. 3.6.1 Overtemperature: Charge
      2. 3.6.2 Overtemperature: Discharge
    7. 3.7  Charging and Charge Termination Indication
    8. 3.8  SCALED Mode
    9. 3.9  LED Display
    10. 3.10 Alert Signal
  5. 4 Communications
    1. 4.1 Authentication
    2. 4.2 Key Programming
    3. 4.3 Executing an Authentication Query
    4. 4.4 HDQ Single-Pin Serial Interface
    5. 4.5 I2C Interface
    6. 4.6 Switching Between I2C and HDQ Modes
      1. 4.6.1 Converting to HDQ Mode
      2. 4.6.2 Converting to I2C Mode
  6. 5 Device Functional Modes
    1. 5.1 NORMAL Mode
    2. 5.2 SLEEP Mode
    3. 5.3 FULL SLEEP Mode
  7. 6 Power Control
    1. 6.1 Reset Functions
    2. 6.2 Wake-Up Comparator
    3. 6.3 Flash Updates
  8. 7 Data Flash Summary
  9. 8 Gas Gauge Timing Considerations
    1. 8.1 Gauging Effects on I2C Transactions
    2. 8.2 HDQ Bus Effects on Gauging
    3. 8.3 Gauging Effects on HDQ Transactions
    4. 8.4 Manufacturer Timing Notes
  10. 9 HDQ Communication Basics
    1. 9.1 Basic HDQ Protocol
    2. 9.2 Break
    3. 9.3 Basic Timing
    4. 9.4 Reading 16-Bit Words
    5. 9.5 Host Processor Interrupts Using Discrete I/O Port for HDQ
    6. 9.6 Using UART Interface to HDQ
  11. 10Procedures to Seal and Unseal the Gauge
    1. 10.1 Unseal the Gauge to UNSEALED Mode
    2. 10.2 Unseal the Gauge to FULL ACCESS Mode
    3. 10.3 Seal the Gauge
  12. 11Impedance Track Gauge Configuration
    1. 11.1 Introduction
    2. 11.2 Determining ChemID
    3. 11.3 Learning Cycle
    4. 11.4 Common Problems Seen During the Learning Cycle
    5. 11.5 Test Gauge and Optimize
    6. 11.6 Finalize Golden File
    7. 11.7 Program and Test the PCB
  13. 12Revision History

8.1 Gauging Effects on I2C Transactions

The sources for gauge operations to impact I2C transactions are interrupt latency, command decode, and the execution of critical code sections. These result in variability to the clock stretches observed on the I2C bus. There is a slight variability in interrupt latency because the timing of communications is asynchronous to gauge processes. The execution path between a halted gauge and one with an active process can be slightly different. Command decoding adds several µs of variability to clock stretches; that is, some commands are decoded more quickly than others. The impact of critical sections is to impact clock stretching on the I2C bus. The most critical sections only add 5 µs to 10 µs of clock stretch. However, if the gauge has initiated an update to its flash data memory, it is possible to see a series of 2-ms to 20-ms clock stretches. With no synchronizing mechanism between the host and gauge, these stretches will appear as random occurrences to the host system.