This section provides a description of the TPS56425XEVM, board layout, and layer illustrations.

Figure 6-2, Figure 6-3, and Figure 6-4 show the board layout for the TPS564252EVM. The top layer contains the main power traces for VIN, VOUT, and ground. Connections for the pins of the TPS564252 and a large area filled with ground are also on the top layer. Most of the signal traces are also located on the top side. The input decoupling capacitors C1, C2, and C3 are located as close to the IC as possible. The input and output connectors, test points, and all of the components are located on the top side. The bottom layer is a ground plane along with the signal ground copper fill and the feedback trace from the point of regulation to the top of the resistor divider network. Both the top layer and bottom layer use 2-oz copper thickness.

Figure 6-5 and Figure 6-6 are the TPS564252EVM board top view and bottom view, respectively.