SLUUCR6 December   2022

 

  1.   BQ25176MEVM Evaluation Module
  2.   Trademarks
  3.   3
  4. 1Introduction
    1. 1.1 Printed Circuit Board Assembly
    2. 1.2 I/O Descriptions
  5. 2Test Summary
    1. 2.1 Equipment
    2. 2.2 Cautions
    3. 2.3 Test Instructions
  6. 3Board Layout, Schematic, and Bill of Materials
    1. 3.1 Board Layout
    2. 3.2 Schematic
    3. 3.3 Bill of Materials
  7. 4Revision History

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WARNING:

Hot surface! Contact may cause burns. Do not touch!

Some components may reach high temperatures >55°C when the board is powered on. The user must not touch the board at any point during operation or immediately after operating, as high temperatures may be present.